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| | slide_list |
 | | [Deut94] Deutsch, A., Swaminathan, M., Ree, M.H.-, Surovic, C.W., Arjavalingam, G., Prasad, K., McHerron, D.C., McAllister, M., Kopcsay, G.V., Giri, A.P., Perfecto, E., and White, G.E., "Measurement of Dielectric Anisotropy of BPDA-PDA Polyimide in Multilayer Thin-Film packages," IEEE Transactions on CHMT, Vol. |
 | | [Loy96] Loy, J., Garg, A., Krishnamoorthy, M., and McDonald, J.F., "Chip Pad Migration is a Key Component to High-Performance MCM Design", Proc. |
 | | % Note: Multiplication of 1E6 ensures the use of all the further units in microns. |
| www.ecse.rpi.edu /frisc/theses/GargThesis/References.html (3887 words) |
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