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| | FPGA Journal |
 | | Furthermore, this is an example of how advanced packaging companies like SPIL can achieve industry success through the use of leading-edge technology such as the Saturn Spectrum 300e2. |
 | | Tool options include a dual-lamp illuminator design and edge-processing capabilities tailored specifically to deliver the superior yield, imaging and throughput performance required for today's 300 mm bump and wafer-level packaging (WLP) applications. |
 | | SPIL is dedicated to meeting all of its customers' integrated circuit packaging and testing requirements, with turnkey solutions that covers from design consultations, modeling and simulations, wafer bumping, wafer probe and sort, package assembly, final test, burn-in, through drop ship. |
| fpgajournal.com /news_stories/20031021_01.htm (641 words) |
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