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Topic: Ball grid array

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	Ball grid array - Wikipedia, the free encyclopedia
		The BGA is descended from the pin grid array (PGA), which is a package with one face covered (or partly covered) with pins in a grid pattern.
		Pin grid arrays and dual-in-line surface mount (SOIC) packages were being produced with more and more pins, and with decreasing spacing between the pins, but this was causing difficulties for the soldering process.
		If a BGA is found to be badly soldered, it can be removed in a rework station, which is a jig fitted with infrared lamp, a thermocouple and a vacuum device for lifting the package.
	en.wikipedia.org /wiki/Ball_grid_array (650 words)

	Ball grid array (Site not responding. Last check: 2007-10-31)
		In BGA the pins are replaced by balls solder stuck to the bottom of the The device is placed on a PCB carries copper pads in a pattern that the solder balls.
		The assembly is then either in a reflow oven or by infrared heater causing the solder balls to Surface tension causes the molten solder to hold package in alignment with the circuit board the correct separation distance while the solder and solidifies.
		The BGA is a solution to the of producing a miniature package for an circuit with many hundreds of pins.
	www.freeglossary.com /BGA (587 words)

	Ball Grid Array - BGA - Page 1 of 2
		The main advantage of BGA as a packaging solution for integrated circuits is its high interconnection density, i.e., the number of pins (or balls, rather) that it offers per given package volume is high.
		In addition, assembly of BGA onto circuit boards is more manageable in comparison to its leaded counterparts of the same pin count, mainly because the solder needed for board mounting already come from the solder balls themselves, which are factory-applied in precise form and size during the assembly of BGA itself.
		The BGA is attached to the circuit board using a reflow oven, which melts the solder balls.
	www.semiconfareast.com /bga.htm (436 words)

	[No title] (Site not responding. Last check: 2007-10-31)
		Ball grid array">Ball grid array (BGA) packages have existed since the 1970s.
		The ball grid array (Ball grid array">BGA) is the latest surface mount package (currently only for large...
		Vision Circuits [http://www.visioncircuits.com] was responsible for creating the footprint for the BGA and also doing all the layout for the PCBs in the Laser Camera System.
	www.worldhistory.com /wiki/B/Ball-grid-array.htm (334 words)

	Ball grid array package having testing capability after mounting patent invention (Site not responding. Last check: 2007-10-31)
		After prior art BGA packages have been mounted to a printed circuit board, the interior balls are not exposed and therefore cannot be tested to ensure proper electrical continuity.
		Ball grid array 20 has a substrate 23 with a top surface 22 and a bottom surface 24.
		Conductive Balls or solder spheres 26 are mechanically and electrically attached to the ball pads 44.
	www.freshpatents.com /Ball-grid-array-package-having-testing-capability-after-mounting-dt20050217ptan20050035450.php (1304 words)

	SolderQuik Ball Grid Array (BGA) Preform
		BGA's have already begun to take over certain segments of the SMT industry, and their hold on the market is expected to continue growing over the next few years.
		BGA Preforms are effective for both initial attach, such as prototyping or small volume production runs, as well as rework, whether for reattach to the board, or for testing.
		BGA Preform consists of an array of solder spheres embedded in a patented water soluble carrier.
	www.winslowautomation.com /bga.asp (867 words)

	Ball grid array: Facts and details from Encyclopedia Topic (Site not responding. Last check: 2007-10-31)
		A ball grid array is a type of surface-mount[For more facts and a topic of this subject, click this link] packaging used for integrated circuit[For more, click on this link]s.
		Pin grid arrays and dual-in-line surface mount (SOIC) packages were being produced with more and more pins, EHandler: no quick summary.
		The pin grid array or pga is a type of packaging used for integrated circuits, EHandler: no quick summary.
	www.absoluteastronomy.com /encyclopedia/b/ba/ball_grid_array.htm (1049 words)

	NEPP - Ball Grid Array (BGA) (Site not responding. Last check: 2007-10-31)
		BGAs, however, are not compatible with multiple solder processing methods, and individual solder joints cannot be inspected and reworked using conventional methods.
		Column grid array (CGA or CCGA) is similar to BGA except it uses column interconnects instead of balls.
		The issues with COTS for BGAs are the same as other COTS issues and include: package die source and materials variations from lot-to-lot, availability of packages with radiation hard die, moisture effect and popcorning for PBGAs, outgassing for materials, etc. Assembly related issues of BGAs have not been an issue.
	nepp.nasa.gov /index_nasa.cfm/773 (777 words)

	BGA - Ball-Grid Array
		Ball Grid Array - a square package with solder balls on the underside for mounting.
		Ball grid array chips typically use a group of solder dots, or balls, arranged in concentric rectangles to connect to a circuit board.
		BGA chips are often used in mobile applications where PGA chips would take up too much space due to the length of the pins used to connect the chips to the circuit board.
	www.auditmypc.com /acronym/BGA.asp (471 words)

	Ball grid array package patent invention (Site not responding. Last check: 2007-10-31)
		A ball is connected to the conductive epoxy.
		The ball is preferably copper and is subsequently coated to prevent corrosion.
		When used with a ball grid array, ball pads are required to be placed around the vias.
	www.freshpatents.com /Ball-grid-array-package-dt20050203ptan20050024839.php (1118 words)

	Ball Grid Array Reliability
		Motorola developed the first plastic ball grid array packages for computer and portable electronics applications, and similar packaging concepts are now being used by all of the major semiconductor suppliers.
		However, in order to meet reliability goals, a thicker substrate was required for the BGA inter-poser board, and only the outermost two rows of solder balls in the large BGA component are being used for I/O during operation.
		For future generation products, smaller BGA packages are being proposed to further reduce the total printed wiring board area covered by the BGA components and to reduce the BGA substrate cost.
	www.eng.auburn.edu /department/ece/cave/bga.htm (338 words)

	BGA Ball Grid Array Package (Site not responding. Last check: 2007-10-31)
		BGA pin connections are solder balls in a grid pattern, in the package bottom.
		Interstitial BGA: (IBGA) This package type carries additional pins, in a n offset pattern, in between the balls of a regular BGA pattern.
		BGA packages have only one type of adatper that can be used which is solder down.
	www.adapters.com /Packages/bga_package.htm (147 words)

	Ball Grid Array - A Great Resource of Information
		A flip-chip type of package in which the internal die terminals form a grid-style array, and are in contact with solder balls (solder bumps), which carry the...
		Qualified Rework and Repair of Ball Grid Array Assemblies Training objective The objective of this training is to supply the student with a theoretical and practical knowledge of the Qualified Rework...
		BGA Assembly Five automated placement systems available with Vision Systems capable of inspecting solder ball coverage Two automated systems available with 3-D laser capable of inspecting solder ball...
	www.ballconnection.com /ballgridarray (1595 words)

	SurfWax: News, Reviews and Articles On Ball Grid Array
		BGA (6-7) carried a 19-17 into halftime, but was outscored 35-24 in the second half.
		The surface-mount adaptor board is modeled on the BGA package, but the device's contacts have been modified to extend out from under the package to scalloped castellations around the edges of the adaptor board.
		BGA edged the Cubs with a walk-off homer in the ninth inning in Thursday's losers bracket finals.
	news.surfwax.com /tech/files/Ball_Grid_Array_BGA.html (4666 words)

	Ball Grid Array Technology: White Electronic Designs -
		Ball grid array packaging is a method for reducing package size and integrating a greater number of functions on a single memory chip module.
		BGA also replaces pins with solder balls on the underside for mounting.
		For more information about ball grid array assembly from WEDC, please follow this link: Ball Grid Array Technology.
	www.wedc.com /ball-grid-array.htm (314 words)

	Ball Grid Array (BGA)
		Ball Grid Array (BGA) packages present numerous benefits previously unobtainable in a single packaging technology.
		BGA’s provide higher pin counts in less area and a robust "ball" structure that integrates seamlessly into the manufacturing process.
		Sticking with the concept of being a one-stop-shop SEA has full Ball Grid Array and micro BGA rework capabilities utilizing an Air-Vac DRS24 BGA rework station.
	www.smartelec.com /bga.html (167 words)

	Defensive Publication for A Low Cost Thermal Ball Grid Array Package (LCTBGA)
		This low cost thermal BGA solution that was developed has shown a significant benefit in both areas but the greatest benefit was seen in the conductive environment where the junction-to-board thermal resistance is the dominant thermal resistance.
		Standard BGA devices usually are assembled with an organic substrate with two interconnect layers, a semiconductor chip, solder balls, gold wire and a encapsulation (liquid or molded).
		The Low Cost Thermal Ball Grid Array package builds on the MAPBGA packaging design by allowing for an improved thermal connection between the silicon die the heat source, and the mai...
	www.priorartdatabase.com /IPCOM/000008765/privacy.jsp (623 words)

	Glossary of Printed Circuit Design and Manufacturing
		A flip-chip type of package in which the internal die terminals form a grid-style array, and are in contact with solder balls (solder bumps), which carry the electrical connection to the outside of the package.
		Advantages of the ball grid array package are (1) that its size is compact and (2) its leads do not get damaged in handling (unlike the formed "gull-wing" leads of a QFP') and thus has a long shelf life.
		In IBM's ceramic BGA's, the solder used in solder balls has a higher melting point than that used in soldering the ball to the chip substrate and the BGA to a board.
	www.goldengategraphics.com /pcgloss.htm (9643 words)

	Packaging
		The wire-bonded MAPBGA (Molded Array Process Ball Grid Array) is an excellent package for low-performance to mid-performance devices that require packaging with low inductance, ease of surface mounting, low cost, small footprint and excellent package reliability.
		The wire-bonded PBGA (Plastic Ball Grid Array) package is an excellent package for mid- to high-performance devices that require low inductance, ease of surface mounting, relatively low cost, and excellent package reliability.
		The TBGA (Tape Ball Grid Array) is a mid to high end BGA packaging solution for applications needing excellent thermal performance without an external heatsink.
	www.freescale.com /webapp/sps/site/overview.jsp?nodeId=0121005372 (532 words)

	HKUST Institutional Repository: Item 1783.1/463
		Computational stress analysis was performed in this study to investigate the solder joint reliability of plastic ball grid array (PBGA) packages with various configurations.
		The model was subjected to a uniform thermal loading and the solder joints were stressed due to the mismatch of coefficient of thermal expansion (CTE).
		A total number of 24 cases, involving different solder ball populations, chip sizes, and substrate thicknesses, were studied.
	hdl.handle.net /1783.1/463 (187 words)

	PBGA Plastic Ball Grid Array Practical Dummy Components
		Plastic Ball Grid Array (PBGA) packages are designed for low inductive, improved thermal operation and enhanced SMT ability.
		Solder ball pitches are 1.0mm, 1.27mm and 1.5mm.
		BGA packages should be baked at 125°C for 48 hours prior to assembly to prevent delamination during the assembly process.
	www.practicalcomponents.com /pbga.htm (248 words)

	Ball Grid Array Inspection and Defect Guide CD-ROM
		Ball Grid Array devices are new to many people so each of the device types is illustrated in the BGA Component section.
		The BGA Defect Guide and Picture Gallery is contained on a number of pages each with six defects per page.
		This example is one of the defect views shown at half screen with the scrollable text box which accompanies each of the defects in the photographic gallery.
	www.electronics.ca /cbt/cdrom1.html (652 words)

	Ball Grid Array
		Over the past 7 years we have seen these packages become smaller and the ball pitch tighter.
		Ability to place BGA devices and perform hand assembly of prototypes without the cost of solder stencils, programming and setup fees.
		In-house Nicolet 1510 X-ray to verify BGA reflow and rework processes.
	www.iesgray.com /ball-grid-array.htm (200 words)

	Cores to Release Ball Grid Array Measurement Device (Site not responding. Last check: 2007-10-31)
		Tokyo, Nov 14, 2001 (JCN) - Cores plans to commercialize a device called "core9020a" to correctly measure the flatness of a Ball Grid Array (BGA), a circuit board on which a chip is mounted.
		Automatic measurement mode can also do measurements and make decisions regarding the acceptability of a BGA, and data will automatically be sent and preserved on an inspection sheet.
		In the conventional inspection method, the BGA was put upside down and measured from 3 dimensions without touching, and "it took 25 min to inspect 250 terminals, which was the biggest pain" said Mr.
	www.japancorp.net /Article.Asp?Art_ID=1445 (229 words)

	BALL GRID ARRAY & FINE PITCH PERIPHERAL INTERCONNECTIONS
		To achieve the connection of high I/O counts to the outside circuitry, two primary IC packaging architectures are available: peripheral interconnections such as quad flat packs (QFPs) and array interconnections such as ball grid arrays (BGAs).
		Both BGAs and QFPs are expected to be prevalent IC packages today and in the future.
		This handbook, dedicated to the interconnection of both array and peripheral IC packages, covers all important aspects related to these packages and their interconnection to the motherboard.
	www.elchempub.com /epfiles/ep28.htm (754 words)

	BGA
		A wide variety of ball-counts and pitches, including 1.27mm and 1.00mm BGAs, the innovative, 0.8mm, near-chip scale Chip Array package, and space-saving 0.5mm pitch Chip Scale BGA package are now available.
		BGA packages offer dramatic board area savings compared to PLCC or QFP package options.
		Lattice is committed to further developing its BGA package offering and providing its customers with the most advanced technology available.
	www.latticesemi.com /products/packaging/bga.cfm (337 words)

	Ball Grid Arrays
		This paper describes the investigation into the effects of temperature cycling of solder joint connections on the board level for a variety of ball grid array packages (BGA).
		An added attraction for BGA packages is that they are compatible with existing surface mount technology (SMT) assembly processes and equipment, so rework is fairly simple.
		A two-side no-clean mass reflow process for large plastic ball grid array (PBGA) and plastic quad flat pack (PQFP) packages is presented.
	www.smtinfo.net /Db/_Ball%20Grid%20Arrays.html (909 words)

	Analog Devices : Embedded Processing & DSP : Products and Data Sheets : Packaging and Numbering : Ball Grid Array (BGA) ... (Site not responding. Last check: 2007-10-31)
		With the ever increasing demand for high density, high I/O count packaging, BGA or Ball Grid Array is fast becoming the next generation package.
		BGA package is a method of reducing package size and pin-to-pin trace gap in order to integrate more functions and reliability in a single space.
		This page will give you information on the technology, the ADI products that are offered in a BGA package, and resources in designing with BGA.
	www.analog.com /processors/productsDatasheets/packagingNumbering/bgaIndex/index.html (183 words)

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