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| | [No title] (Site not responding. Last check: 2007-10-18) |
 | | Traditional etching chemicals, such as, for example, carbon tetrafluoride, hexafluoroethane, perfluoropropane, nitrogen trifluoride, bis (trifluoromethyl) disulfide, and sulfur hexafluoride, and their perfluorinated by-products, such as carbon tetrafluoride and hexafluoroethane, have relatively high Global Warming Potentials. |
 | | Even though the HFC etchant compounds for use in the present invention have a fluorine to carbon ratio no greater than 2 to 1 (as set forth in Formula (1)) which is less than traditional etchants, it has been found that these etchant compounds, nevertheless, etch a wide variety of materials. |
 | | In fact, as shown in the examples below, HFC-245fa, which has a fluorine to carbon ratio of 5: 3, etches some materials more rapidly than its more-fluorinated counterpart HFC- 236fa, which has a fluorine to carbon ratio of 2: 1. |
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