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| | Process for removing residues from a semiconductor substrate - Patent 6033993 |
 | | The process of claim 10, wherein said water-soluble corrosion inhibitor is an hydroxylammonium salt selected from the group consisting essentially of hydroxylammonium nitrate, hydroxylammonium sulfate, hydroxylammonium phosphate, hydroxylammonium chloride, hydroxylammonium oxalate, hydroxylammonium citrate, and combinations thereof. |
 | | Some of these parameters may include the type of substrate, the specific corrosion inhibitors used, the specific corrosive residuals present, the geometry and size of the substrate to be protected against corrosion, the flow velocity of the residuals, temperature, pressure, and the like. |
 | | The phrase "water-soluble corrosion inhibitor" refers to those corrosion inhibitors that are substantially dissolved in water at a concentration of "effective corrosion-inhibiting amount" at ambient temperatures. |
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