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Topic: Dual Inline Package

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	Dual Inline Package
		The dual inline package (DIP) was designed primarily to overcome the difficulties associated with handling and inserting packages into mounting boards.
		A promising packaging technique is the face-down (FLIP-CHIP) mounting method by which conductive patterns are evaporated inside the package before the die is attached.
		The pads are then bonded to appropriate pedestals on the package that correspond to those of the bonding pads on the die (figure 1-26).
	www.tpub.com /neets/book14/57g.htm (701 words)

	comphis (Site not responding. Last check: 2007-10-25)
		The most common package for an IC is the dual inline package, or DIP.
		DIPs contain two rows of pins and are usually fl with markings on top indicating their manufacturer and purpose.
		DIPs are commonly seen being used as memory chips, although this design is being used less and less.
	hagar.up.ac.za /catts/learner/heilap/assignments/dual.html (51 words)

	DIP switch - TheBestLinks.com - Electronic, TheBestLinks.com:Find or fix a stub, Printed circuit board, ... (Site not responding. Last check: 2007-10-25)
		A DIP switch is an electric switch that is packaged in a standard Dual-Inline Package or DIP.
		Because of the DIP form factor, arrays of multiple switches can easily be incorporated into the same package.
		DIP switches are often used instead of jumper blocks where a setting may be changed more than once.
	www.thebestlinks.com /DIP_switch.html (166 words)

	The Chip Collection - TI Package Object Listing - Smithsonian Institution
		The goal was the smallest practical package in which a germanium grown junction transistor could be assembled.
		This solder sealed package was successfully used for hearing aid transistors for a couple of years.
		From memory and the packages shown, this display was probably made in the latter part of 1953.
	smithsonianchips.si.edu /texas/pkg.htm (2037 words)

	IC Packaging services for Semiconwell board level electronic integrated passive networks, integrated circuits and ...
		DIP package is through-hole integrated circuit mount package.
		DIP components come packaged in tubes, bulk, and tape and reel.
		Popular sizes are DIP 300 mil body and DIP 600 mil body, 8 to 48 pins.
	www.semiconwell.com /packages/dip.htm (76 words)

	PC ComputerNotes - Integrated Circuits
		The Dual Inline Package or DIP is rectangular in shape with two rows of pins coming from it.
		The QSOP chip is generally square and soldered flat to the surface of the circuit board.
		These packages were small rectangular chips with pins coming from only one side.
	www.pccomputernotes.com /integrated_circuits/ics02.htm (283 words)

	Dual Inline Package (DIP)
		DIP packaging is in fact the standard packaging used for most regular integrated circuits.
		DIP packaging quickly became inadequate for use for processors when the number of signals going to and from them grew large.
		Modern processors have literally hundreds of signals that go to and from the motherboard, and since the DIP package only allows for two rows of pins this would have made for a really looooong package.
	www.pcguide.com /ref/cpu/char/packDIP-c.html (197 words)

	CL-1: Learning Through Technology (LT^2): Resources: Glossary
		For example, on computers with 2 hard drives, the DIP switches are used to define which hard drive is the master (primary) and which is the slave (secondary) hard drive.
		A dual inline memory module has a 168-pin connector allowing for 64-bit data transfer, twice the data transfer rate of SIMMs (single inline memory module).
		For example, on computers with 2 hard drives, the dual inline package switches are used to define which hard drive is the master (primary) and which is the slave (secondary) hard drive.
	www.wcer.wisc.edu /archive/cl1/ilt/resource/glossaryDEF.htm (2247 words)

	Computer Memory
		Memory chips are called DIPs which stands for Dual Inline Packages.
		To make memory installation easier than it was in the past, these DIP chips were places on modules.
		To install these packages, you press them into the socket on the motherboard and latch them in with a plastic latch on both sides.
	www.comptechdoc.org /hardware/pc/begin/hwmemory.html (633 words)

	MTC Dynamics - Computer Repair and Maintenance Tutorial (Site not responding. Last check: 2007-10-25)
		The sockets (or slots) where the CPU mounts are one of the most easily recognizable items on a motherboard, simply because most often they are the largest item on the motherboard.
		Original IBM PC used what is called a DIP package to install their CPU to the motherboard.
		The DIP (Dual Inline Pin or Dual Inline Package) package is for the most part what people think of when they think of an integrated circuit.
	www.computercareandmore.com /section2p10.html (282 words)

	Embedded Systems/PIC Microcontroller - Wikibooks
		Hobbyists generally use the plastic dual inline package (often called DIP or PDIP) because it's the easiest to stick in a solderless breadboard and tinker with.
		They avoid using ceramic dual inline package (CDIP), not because ceramic is bad (it's just as easy to plug into a solderless breadboard), but because the plastic parts work just as well and are much cheaper.
		And then each different package, for each member of each family, comes in both a "commercial temperature range" and a "industrial temperature range".
	en.wikibooks.org /wiki/PIC (456 words)

	Dual Inline Package
		The dual inline package (DIP) was designed primarily to overcome the difficulties associated with
		Ceramic DIPs are processed individually while plastic DIPs are processed in quantities of two or
		Kovar lead frame, but the leads are not bent until the package is completed.
	www.tpub.com /content/neets/14186/css/14186_37.htm (261 words)

	Memory Guide by DELEC (USA) (Site not responding. Last check: 2007-10-25)
		By far the most common package type is the SOJ (Small Outline 'J' lead).
		The DIP was more widely used before the SOJ became the favored package type.
		DIP leads often go through the PCB board, in contrast with the surface mounted SOJ and TSOP.
	www.delec.com /guide/memory (1979 words)

	Amkor: CDIP / CerDIP / Ceramic DIP
		The CDIP is a hermetic package consisting of two pieces of dry pressed ceramic surrounding a "DIP formed" leadframe.
		Along with the other standard industry packages, the CDIP has a proven track record and is still being used by semiconductor technologies such as: Digital to Analog converters, EPROMS, Air bag sensors, Accelerometers (MEMS Packaging), Logic, Memory, Microcontrollers, and Video controllers.
		For more information on the CDIP package, please contact an Amkor Regional Sales Office near you, your Account Manager or fill out the Request for Additional Information Form.
	www.amkor.com /Products/all_products/CDIP.cfm (239 words)

	DIP IC Package Information
		DIP is a thru-hole device with typical lead spacing of 0.100" on two sides of the package body.
		Today many DIP devices translate directly to SOIC or TSOP packages for higher density applications.
		Shrink DIP (SDIP): Shrink DIP packages usually have higher pin counts (i.e., 48 or 64 lead).
	www.adapters.com /Packages/dip_package.htm (100 words)

	Thick Film Hybrid Technology - ISSI provides custom electronic design and manufacturing for a variety of industries, ...
		A hybrid circuit is a device that performs all or part of an electronic function by combining and interconnecting several passive and active semiconductor devices into a single package.
		The printed pastes are then fired in temperature controlled, multi-zone furnaces -- fusing the pastes to the base material and becoming an integral part of the circuit.
		Passive and active semi-conductor packages are reflowed onto the printed substrate.
	www.internationalsensor.com /HYBRID_PAGE_HTML/HYBRID_PAGE.htm (427 words)

	Programmable array logic -- Facts, Info, and Encyclopedia article (Site not responding. Last check: 2007-10-25)
		However, the PAL allows reuse of function outputs, and can be then used in another PAL program block.
		Early PALs were 20-pin DIP (dual inline package) components fabricated in bipolar silicon transistor technology with nichrome programming fuses.
		One PAL device would typically replace dozens of such 'discrete' logic packages, so the SSI business went into decline as the PAL business took off.
	www.absoluteastronomy.com /encyclopedia/p/pr/programmable_array_logic.htm (343 words)

	Datasheet catalog for electronic components integrated circuit, transistor, diode, triac, and other semiconductors.
		Dual Inline Package, Molded DIP, 01, 03, 05 Schematics, Rugged, Molded Case Construction, Highly Stable, Automatic Insert Compatible, Uniform Performance Characteristics, Available in Tube Pack
		Dual Inline Package, Molded DIP, Rugged, Molded Case Construction, Highly Stable, Automatic Insert Compatible, Available in Tube Pack, Reduces Assembly Costs
		Dual Inline Package, Molded DIP, 16 Pin, Rugged, Molded Case Construction, Highly Stable, Automatic Insert Compatible, Reduces Assembly Costs
	www.datasheetcatalog.com /catalog/p210840.shtml (378 words)

	FOD2741A/B/C: New Optically Isolated Error Amplifier To Simplify Offline Power Conversion Designs- Fairchild ...
		The FOD2741 incorporates an optocoupler, precision reference, and error amplifier into an 8-pin white, dual-inline package, making it the functional equivalent of a Fairchild KA431 shunt voltage regulator and a CNY17F-3 optocoupler in a single, space saving device.
		The FOD2741 has UL, CSA, VDE and BSI safety agency certification, and the 8-pin white, dual-inline package is available in through hole or surface mount lead configurations.
		Surface mount devices are also available in tape and reel packaging with a 1,000 unit quantity on a 13-inch (330 mm) diameter reel.
	www.fairchildsemi.com /news/2002/0210/fod2741.html (407 words)

	RF Cafe - Package Outlines
		Your browser does not support inline frames or is currently configured not to display inline frames.
		Click on the image of the package family of interest for dimensioned drawings of common pin counts.
		Note: These designations are often followed by numbers that indicate the number of leads.
	www.rfcafe.com /references/electrical/packages.htm (67 words)

	Resistor networks - Vishay - Resistor networks, Thick film
		Single Inline Package, Molded SIP, 01, 03, 05 Schematics, 6, 8, 9, or 10 Pin 'A' Profile, 6, 8, or 10 Pin 'C' Profile, Highly Stable, Rugged, Molded Case Construction, Automatic Insert Compatible
		Dual Inline Package, Small Outline Molded DIP, 16 or 20 Pins, Rugged, Molded Case Construction, Highly Stable, Automatic Surface Mount Compatible, Reduces Assembly Costs, Uniform Performance Characteristics
		Dual Inline Package, Small Outline Molded DIP, 14, 16, or 20 Pins, Rugged, Molded Case Construction, Highly Stable, Automatic Surface Mount Compatible, Reduces Assembly Costs,
	www.vishay.com /resistor-networks/all-resistor-networks/thick-film (313 words)

	andreas.com FAQ: Glossary of Computer Terms
		To protect them and to make them easier to handle, they are encased in brown ceramic cases which have little legs and look like bugs.
		The bug is called a dual inline package (DIP) chip.
		SIMM Chips: Single Inline Memory Module, which is a row of RAM chips on a small card.
	www.andreas.com /faq-glossary.html (5560 words)

	ANADIGICS Press Release - ANADIGICS Receives CATV Circu...
		The patent covers the monolithic upconverter integrated circuit that performs the first frequency conversion of a dual conversion cable television (CATV) receiver.
		Mixing is performed by a novel Gilbert type mixer, which includes image-reduction inductors to improve the noise figure of the mixer.
		"A differential circuit topology allows the monolithic upconverter chip to use a plastic dual inline package without considerable performance loss," Scheinberg said.
	www.anadigics.com /press/release.jsp?id=148 (346 words)

	fastest CPU in DIP format? - Design
		That's the other reason why I was hoping for a DIP package
		Pins are thick because the package is large.
		SMD packages weigh less so are less bothered about 'rough handling'.
	www.electronicshelp.net /post-9068.html (1856 words)

	Radio Frequency Components Products Modules Low Power Virtual Wire Frequency Control Modules Filters SAW RF ... (Site not responding. Last check: 2007-10-25)
		RF Monolithics, Inc. has a variety of packages.
		RFM's packages range from Metal DIP to Ceramic Surface-Mount.
		All oscillators are housed in hermetic dual-in-line packages (DIPs) or flatpack packages.
	www.rfm.com /products/case.htm (141 words)

	Package Information
		MDP0042 HSOP Heatsink SO Package, Slug-Down, 2 Mil Stand-Off
		MDP0046 QFN (Quad Flat No-Lead) Package Family (Formerly Known as LPP)
		TB379 — Thermal Characterization of Packaged Semiconductor Devices
	www.intersil.com /design/packages/index.asp (120 words)

	Elexol Website - Home
		The USB I/O 24 DIP shown in Diagram 1 is a Dual Inline Package version of the USB I/O 24 module.
		Thismakes the USB I/O 24 DIP ideal for rapid prototyping and development work.
		The outputs of the module are able to source or sink up to 30mA per I/O, up to a maximum 50mA per port, to allow for direct connection to a variety of device.
	www.elexol.com (732 words)

	Solid State Relays - Vishay - Package options
		4 Pin SMD Low Profile Package (Height = 2 mm) creepage distance and air path ≥ 5 mm after mounting on PC board
		DIP - 6 Pin - Dual Inline Package
		DIP - 8 Pin - Dual Inline Package
	www.vishay.com /solid-state-relays/packages-list (214 words)

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