Dual-Inline Package - Factbites

Dual-Inline Package - Factbites
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Topic: Dual-Inline Package

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	Dual Inline Package
		The dual inline package (DIP) was designed primarily to overcome the difficulties associated with handling and inserting packages into mounting boards.
		The pads are then bonded to appropriate pedestals on the package that correspond to those of the bonding pads on the die (figure 1-26).
		A promising packaging technique is the face-down (FLIP-CHIP) mounting method by which conductive patterns are evaporated inside the package before the die is attached.
	www.tpub.com /neets/book14/57g.htm (701 words)

	comphis
		The most common package for an IC is the dual inline package, or DIP.
		DIPs contain two rows of pins and are usually black with markings on top indicating their manufacturer and purpose.
		DIPs are commonly seen being used as memory chips, although this design is being used less and less.
	hagar.up.ac.za /catts/learner/heilap/assignments/dual.html (51 words)

	DIP IC Package Information
		DIP is a thru-hole device with typical lead spacing of 0.100" on two sides of the package body.
		Shrink DIP (SDIP): Shrink DIP packages usually have higher pin counts (i.e., 48 or 64 lead).
		Today many DIP devices translate directly to SOIC or TSOP packages for higher density applications.
	www.adapters.com /Packages/dip_package.htm (100 words)

	The Chip Collection - TI Package Object Listing - Smithsonian Institution
		From memory and the packages shown, this display was probably made in the latter part of 1953.
		This solder sealed package was successfully used for hearing aid transistors for a couple of years.
		The goal was the smallest practical package in which a germanium grown junction transistor could be assembled.
	smithsonianchips.si.edu /texas/pkg.htm (2037 words)

	Embedded Systems/PIC Microcontroller - Wikibooks
		Hobbyists generally use the plastic dual inline package (often called DIP or PDIP) because it's the easiest to stick in a solderless breadboard and tinker with.
		They avoid using ceramic dual inline package (CDIP), not because ceramic is bad (it's just as easy to plug into a solderless breadboard), but because the plastic parts work just as well and are much cheaper.
		And then each different package, for each member of each family, comes in both a "commercial temperature range" and a "industrial temperature range".
	en.wikibooks.org /wiki/PIC (456 words)

	MTC Dynamics - Computer Repair and Maintenance Tutorial
		The DIP (Dual Inline Pin or Dual Inline Package) package is for the most part what people think of when they think of an integrated circuit.
		Original IBM PC used what is called a DIP package to install their CPU to the motherboard.
		The sockets (or slots) where the CPU mounts are one of the most easily recognizable items on a motherboard, simply because most often they are the largest item on the motherboard.
	www.computercareandmore.com /section2p10.html (282 words)

	CL-1: Learning Through Technology (LT^2): Resources: Glossary
		For example, on computers with 2 hard drives, the dual inline package switches are used to define which hard drive is the master (primary) and which is the slave (secondary) hard drive.
		A dual inline memory module has a 168-pin connector allowing for 64-bit data transfer, twice the data transfer rate of SIMMs (single inline memory module).
		For example, on computers with 2 hard drives, the DIP switches are used to define which hard drive is the master (primary) and which is the slave (secondary) hard drive.
	www.wcer.wisc.edu /archive/cl1/ilt/resource/glossaryDEF.htm (2247 words)

	PC ComputerNotes - Integrated Circuits
		The Dual Inline Package or DIP is rectangular in shape with two rows of pins coming from it.
		These packages were small rectangular chips with pins coming from only one side.
		There are different types and sizes (packages) of Integrated Circuits.
	www.pccomputernotes.com /integrated_circuits/ics02.htm (283 words)

	Computer Memory
		Memory chips are called DIPs which stands for Dual Inline Packages.
		To install these packages, you press them into the socket on the motherboard and latch them in with a plastic latch on both sides.
		To make memory installation easier than it was in the past, these DIP chips were places on modules.
	www.comptechdoc.org /hardware/pc/begin/hwmemory.html (633 words)

	Dual Inline Package (DIP)
		The first Intel and compatible processors, used on the original PC, XT and clones, used standard dual inline or DIP packaging.
		Modern processors have literally hundreds of signals that go to and from the motherboard, and since the DIP package only allows for two rows of pins this would have made for a really looooong package.
		DIP packaging quickly became inadequate for use for processors when the number of signals going to and from them grew large.
	www.pcguide.com /ref/cpu/char/packDIP-c.html (197 words)

	Radio Frequency Components Products Modules Low Power Virtual Wire Frequency Control Modules Filters SAW RF Monolithics, Inc.(RFM)
		Metal dual-inline package with 8 leads in a 16-lead DIP configuration
		Metal dual-inline package with 8 leads in a 14-lead DIP configuration
		All oscillators are housed in hermetic dual-in-line packages (DIPs) or flatpack packages.
	www.rfm.com /products/case.htm (141 words)

	Programmable array logic -- Facts, Info, and Encyclopedia article
		Early PALs were 20-pin DIP (dual inline package) components fabricated in bipolar silicon transistor technology with nichrome programming fuses.
		One PAL device would typically replace dozens of such 'discrete' logic packages, so the SSI business went into decline as the PAL business took off.
		However, the PAL allows reuse of function outputs, and can be then used in another PAL program block.
	www.absoluteastronomy.com /encyclopedia/p/pr/programmable_array_logic.htm (343 words)

	Memory Guide by DELEC (USA)
		The DIP was more widely used before the SOJ became the favored package type.
		By far the most common package type is the SOJ (Small Outline 'J' lead).
		The two most common types of memory modules are the 30 pin and 72 pin Single Inline Memory Modules or SIMMs.
	www.delec.com /guide/memory (1979 words)

	Amkor: CDIP / CerDIP / Ceramic DIP
		Along with the other standard industry packages, the CDIP has a proven track record and is still being used by semiconductor technologies such as: Digital to Analog converters, EPROMS, Air bag sensors, Accelerometers (MEMS Packaging), Logic, Memory, Microcontrollers, and Video controllers.
		The CDIP is a hermetic package consisting of two pieces of dry pressed ceramic surrounding a "DIP formed" leadframe.
		For more information on the CDIP package, please contact an Amkor Regional Sales Office near you, your Account Manager or fill out the Request for Additional Information Form.
	www.amkor.com /Products/all_products/CDIP.cfm (239 words)

	andreas.com FAQ: Glossary of Computer Terms
		The bug is called a dual inline package (DIP) chip.
		SIMM Chips: Single Inline Memory Module, which is a row of RAM chips on a small card.
		To protect them and to make them easier to handle, they are encased in brown ceramic cases which have little legs and look like bugs.
	www.andreas.com /faq-glossary.html (5560 words)

	Electronic Technology at Western Nebraska Community College - Advanced Soldering Technique
		It includes soldering of terminals, axial lead components, multi-leaded components, dual inline package ICs, surface mount technology, edge connector and substrate repair.
		The student is given instruction on the uses of different types of soldering equipment and then demonstrates with "hand-on" lab projects.
	www.wncc.net /courses/electronics/advsolderingtech.htm (111 words)

	ECE-UF Acronyms C-D
		Dual Pole Single Throw (as in a switch)
		Dual Pole Dual Throw (as in a switch)
	www.eel.ufl.edu /undergraduates/acronymsc-d.html (16 words)

	fastest CPU in DIP format? - Design
		Pins are thick because the package is large.
		SMD packages weigh less so are less bothered about 'rough handling'.
		That's the other reason why I was hoping for a DIP package
	www.electronicshelp.net /post-9068.html (1856 words)

	Maramil: SMD to DIP Adapters and Microcontroller Products
		Although the 430 series of SMD to DIP (Dual Inline Pin) Adapters Kits are designed for the Texas Instrument's MSP430 microcontroller family, they can be used to adapt non-MSP430 SMD parts if they have the same JEDEC footprint as the respective Adapter Kit, check the FAQs for more information.
		It is easy to mount the parts on the 430 SMD to DIP Adapter Kits without using expensive SMD rework tools by downloading our free comprehensive tutorials.
		That is where our SMD (SMT) to DIP adapter products can help.
	www.maramil.com (421 words)

	FOD2741A/B/C: New Optically Isolated Error Amplifier To Simplify Offline Power Conversion Designs- Fairchild Semiconductor
		The FOD2741 incorporates an optocoupler, precision reference, and error amplifier into an 8-pin white, dual-inline package, making it the functional equivalent of a Fairchild KA431 shunt voltage regulator and a CNY17F-3 optocoupler in a single, space saving device.
		The FOD2741 has UL, CSA, VDE and BSI safety agency certification, and the 8-pin white, dual-inline package is available in through hole or surface mount lead configurations.
		Surface mount devices are also available in tape and reel packaging with a 1,000 unit quantity on a 13-inch (330 mm) diameter reel.
	www.fairchildsemi.com /news/2002/0210/fod2741.html (407 words)

	Defintion of dual_inline_package_dip - Chemistry Dictionary
		an integrated circuit package that has two rows of leads extended at right angles from the base and a standard spacing between the leads and rows of leads; usually plastic (PDIP) or ceramic (cerdip).
	www.chemicool.com /definition/dual_inline_package_dip.html (50 words)

	Elexol Website - Home
		The USB I/O 24 DIP shown in Diagram 1 is a Dual Inline Package version of the USB I/O 24 module.
		The module's 50 pin Dual Inline Package (DIP) fits into a standard 50 pin 900mil wide IC Socket.
		The outputs of the module are able to source or sink up to 30mA per I/O, up to a maximum 50mA per port, to allow for direct connection to a variety of device.
	www.elexol.com (732 words)

	RF Cafe - Package Outlines
		Your browser does not support inline frames or is currently configured not to display inline frames.
		Click on the image of the package family of interest for dimensioned drawings of common pin counts.
		Note: These designations are often followed by numbers that indicate the number of leads.
	www.rfcafe.com /references/electrical/packages.htm (67 words)

	Resistor networks - Vishay - Resistor networks, Thick film
		Dual Inline Package, Molded DIP, 01, 03, 05 Schematics, Rugged, Molded Case Construction, Highly Stable, Automatic Insert Compatible, Uniform Performance Characteristics, Available in Tube Pack
		Dual Inline Package, Small Outline Molded DIP, 14, 16, or 20 Pins, Rugged, Molded Case Construction, Highly Stable, Automatic Surface Mount Compatible, Reduces Assembly Costs,
		Single Inline Package, Molded SIP, 01, 03, 05 Schematics, 6, 8, 9, or 10 Pin 'A' Profile, 6, 8, or 10 Pin 'C' Profile, Highly Stable, Rugged, Molded Case Construction, Automatic Insert Compatible
	www.vishay.com /resistor-networks/all-resistor-networks/thick-film (313 words)

	The 741 Op-Amp
		The 741 is usually supplied in an 8-pin ‘DIL’ (Dual In Line) or ‘DIP’ (Dual Inline Package, or sometimes Dual Inline Plastic) package with a pinout shown above.
		This has proved so popular that many other competing op-amps have adoped the same package/pinout.
		This means it is easy to use, but the down-side of this is the poor speed/gain performance compared to more modern op-amps.
	www.st-andrews.ac.uk /~jcgl/Scots_Guide/datasheets/Opamps/741.html (302 words)

	661
		A single inline memory module (SIMM) is different from a dual inline memory module (DIMM) because __________.
		A __________ is a higher-performance PGA packaging that places the chip on opposite sides of the pins.
		SIMMs typically use RDRAM chips, but DIMMs use SDRAM chips
	gcclearn.gcc.cc.va.us /leung/stchp4ist114.htm (2203 words)

	Package Information
		TB379 — Thermal Characterization of Packaged Semiconductor Devices
		MDP0046 QFN (Quad Flat No-Lead) Package Family (Formerly Known as LPP)
		MDP0042 HSOP Heatsink SO Package, Slug-Down, 2 Mil Stand-Off
	www.intersil.com /design/packages/index.asp (120 words)

	ANADIGICS Press Release - ANADIGICS Receives CATV Circu...
		"A differential circuit topology allows the monolithic upconverter chip to use a plastic dual inline package without considerable performance loss," Scheinberg said.
		"On-chip RF bypass networks, in the form of series RC terminations, also help compensate for the undesirable effects of pin inductances in the dual inline package.
		The patent covers the monolithic upconverter integrated circuit that performs the first frequency conversion of a dual conversion cable television (CATV) receiver.
	www.anadigics.com /press/release.jsp?id=148 (346 words)

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