| |
| | Device Microanalysis of Electronic Materials (Site not responding. Last check: 2007-10-12) |
 | | Structural and chemical analysis of electronic materials is performed by various microanalytical techniques, including Auger electron spectroscopy, secondary electron spectroscopy, energy dispersive x-ray spectroscopy, x-ray diffraction, secondary ion mass spectroscopy (SIMS), focused ion beam microscopy, and transmission electron microscopy. |
 | | A PHI 660 scanning Auger microprobe/scanning electron microscope (SEM) ultrahigh vacuum (UHV) system is available, which is equipped with a coaxial cylindrical mirror analyzer, duoplasmatron ion sputter gun, high-precision stage with tilt, manual and automatic rotation, hot and cold stage, and a high-speed graphics workstation. |
 | | The following microscopy equipment is available: (1) a Hitachi S4500 field emission secondary electron microscope equipped with a Princeton Gamma-Tech energy dispersive x-ray spectrometer; (2) a JEOL 2010 transmission electron microscope which includes selected-area diffraction, convergent beam electron diffraction, and high-resolution crystal imaging; and (3) a Micrion 9000 focused ion beam tool. |
| www4.nationalacademies.org /pga/rap.nsf/ByTitle/76.31.04.B3231?OpenDocument (266 words) |
|