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Method of packaging electronic component parts using a eutectic die bonder - Patent 4984731 |
 | | Electronic component parts intended for eutectic bonding are not molded and called "bare chips", and this type of electronic component parts are generally required to be mounted at a very high accuracy. |
 | | The camera is used to observe the thermal expansion of the substrate, and the movable table is moved in accordance with the observation result so as to modify the mount coordinates of an electronic component part, thereby correcting the displacement of electronic component parts caused by the substrate thermal expansion. |
 | | At a temperature above the eutectic temperature, the moving tables 21 and 22 are moved slightly so that the materials 13 and 14 are rendered a frictional slide, and the materials are connected. |
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