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| | 3D |
 | | Fan, C. Tan, and R. Reif, “Contact Resistance Measurement of Bonded Copper Interconnects for Three-Dimensional Integration Technology”, IEEE Electron Devices Letters, 51(2), pp 10-12, 2004. |
 | | Chen, C. Tan, A. Fan and R. Reif, “Morphology and bond strength of copper wafer bonding”, Electrochemical and Solid-State Letters, 7(1), pp G14-G16, 2004. |
 | | Chen, A. Fan, C. Tan and R. Reif, “Microstructure evolution and abnormal grain growth during copper wafer bonding,” |
| www-mtl.mit.edu /users/reif_old/project/3d.htm (1067 words) |
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