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 | | It provided the benefits of a solid-state solution for many applications, but its performance was limited by several drawbacks: It requires a high base current to turn on, it has relatively slow turn-off characteristics (known as current tail), and it's susceptible to thermal runaway due to its negative temperature coefficient. |
 | | Certainly, the IGBT is the choice for breakdown voltages above 1000 V, while the MOSFET is for device breakdown voltages below 250 V. Device selection isn't so clear, though, when the breakdown voltage is between 250 and 1000 V. In this range, some components vendors advocate the use of MOSFETs. |
 | | In this particular scenario, the IGBT appears to be the device of choice. |
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