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| | PRESS RELEASE STATS ChipPAC's IPD Technology Reaches High Volume Manufacturing Levels (Site not responding. Last check: 2007-10-12) |
 | | Silicon IPDs such as resistors, capacitors, inductors, filters, diplexers, and baluns can be assembled into a package with other surface mount components on a laminate substrate or placed in a three dimensional (3D) die stack configuration. |
 | | IPD technology is supported with a full turnkey service offering encompassing design and characterization, wafer production, wafer level test, RF assembly and test. |
 | | "IPD technology simplifies complex RF systems and significantly expands the range of integration opportunities that are available for RF customers seeking high performance, small form factor and cost effective solutions from silicon design to high end build up substrates," continued Dr. Han. |
| www.marketwire.com /mw/release_html_b1?release_id=166237 (858 words) |
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