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| | Latent catalysts for molding compounds - Patent 6822341 |
 | | An epoxy molding compound as in claim 18, wherein the inorganic carrier and the filler component are independently selected from the group consisting of silica, alumina, aluminosilicate, aluminum trihydrate, silicon nitride, clay, talc, mica, kaolin, calcium carbonate, wollastonite, montmorillonite, smectite, and combinations thereof. |
 | | Desirably, the catalyst compound is a nitrogen-containing catalyst compound, with at least a portion of the nitrogen atoms of the nitrogen-containing catalyst being bonded to the inorganic-based carrier through a hydrogen bond, thus forming an acid-base complex. |
 | | The nitrogen-containing compound may be an amine compound, an amide compound, an imidazole compound, or a mixture or combination thereof that is capable of initiating (accelerating) the cure of an epoxy formulation. |
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