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| | Prof. King-Ning Tu, UCLA |
 | | The effect of current crowding on joule heating as well as on stress concentration will be analyzed. |
 | | Huang, E. Yeh, Z. Zhang, and K. Tu, "The effect of contact resistance on current crowding and electromigration in ULSI multi-level interconnects," Materials Chemistry and Physics, 77, 377-383 (2003). |
 | | Alam, Y. Chan, K. Tu, and J. Kivilahti, “Effect of 0.5 wt% Cu in Sn-3.5% Ag solder ball on the solid state interfacial reaction with the Au/Ni/Cu bond pad for ball grid array (BGA) applications,” Chemistry of Materials, Vol. |
| www.seas.ucla.edu /ms/faculty1/tu.html (2233 words) |
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