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	Land grid array (Site not responding. Last check: 2007-10-04)
		The land grid array (LGA) is an interface for microprocessors of the Intel Pentium 4 family.
		Unlike the pin grid array (PGA) interface that is found in all AMD and most Intel processor-based systems, there are no pins on the chip; in place of the pins are 'pads' of bare copper in which pins on the motherboard contact.
		LGA is less expensive than both PGA and the similar ball grid array (BGA) interfaces.
	pedia.newsfilter.co.uk /wikipedia/l/la/land_grid_array.html (180 words)

	Land grid array - Wikipedia, the free encyclopedia
		The land grid array (LGA) is a physical interface for microprocessors of the Intel Pentium 4 family.
		Unlike the pin grid array (PGA) interface found on most AMD and Intel processors, there are no pins on the chip; in place of the pins are pads of bare gold-plated copper that touch pins on the motherboard.
		LGA is less expensive to produce than both PGA and the similar ball grid array (BGA) interfaces.
	en.wikipedia.org /wiki/Land_grid_array (227 words)

	Apparatus for attaching/detaching a land grid array component to a circuit board - Patent 5740954
		Land grid array components are a class of surface mounted components that employ a grid array of solder connections on a surface of the component.
		The surface bearing the land grid array is positioned to confront an identical grid array of circuit pads on a circuit board, and the solder beads, balls or columns are heated to reflow to attach or detach the component from the circuit board.
		The beads of the land grid array resolidify by lowering the level of the inert liquid in the chamber from its second level to its first level while the second mounting means biases the component against the circuit board, thereby establishing the solid conductive connections of the land grid array.
	www.freepatentsonline.com /5740954.html (3146 words)

	[No title] (Site not responding. Last check: 2007-10-04)
		Simply put, the capability of the individual lands to carry power is limited due to the small size of the land grid array and the electrical connections made to the land grid array.
		Another technical problem with land grid array packages is that there is a short wiping distance between the land and the contact as the contact is initially placed in contact with the land.
		In its initial position, the solid end 230 of the land grid array package 200 is not engaged with the slot 450 of the socket 400, and the lobe 720 of the cam 700 is positioned away from the slot 450.
	www.wipo.int /cgi-pct/guest/getbykey5?KEY=03/103045.031211&ELEMENT_SET=DECL (4983 words)

	Encyclopedia: Land grid array
		Unlike the pin grid array (PGA) interface that is found in all AMD and most Intel processor-based systems, there are no pins on the chip; in place of the pins are 'pads' of bare gold plated copper in which pins on the motherboard contact.
		LGA connectors are an evolving technology in which an interconnection between mating surfaces of a module or other area array device and a printed circuit board is provided through a conductive interposer.
		A rectangular array of contacts on the underside of the module are connected by the interposer to a matching array of pads or lands on the circuit board.
	www.nationmaster.com /encyclopedia/Land-grid-array (792 words)

	Land Grid Array --> Info and Comparisons (Site not responding. Last check: 2007-10-04)
		Pin grid arrays and dual-in-line surface mount (SOIC) packages were being produced with more and more pins, and with decreasing spacing between the pins, but this was causing difficulties for the soldering process.
		The plastic pin grid array (PPGA) and later flip-chip pin grid array (FCPGA) versions were both created by Intel Corporation for their Pentium processors, and are often used on motherboards with ZIF (Zero Insertion Force) sockets to protect the delicate pins.
		As with the pin grid array, there is generally a section in the middle of the IC without any pins.
	www.crashdatabase.com /computers/77/land-grid-array.html (1070 words)

	Flip-chip pin grid array - Wikipedia, the free encyclopedia
		The Flip Chip Pin Grid Array is similar to PPGA, except that the silicon core is facing up and the heat slug is exposed.
		The FC-PGA2 packaging has been replaced by the land grid array (LGA775) packaging on Prescott-based Pentium 4 and Celeron D processors.
		Pentium 4 processors are also available in Socket 423 Organic Land Grid Array (OLGA) on Interposer (OOI) (INT2 and INT3) and Socket T LGA775 packaging.
	en.wikipedia.org /wiki/Flip-chip_pin_grid_array (258 words)

	Land grid array package/circuit board assemblies and methods for constructing the same - Patent 5473510
		The interconnection array typically is fabricated of a compressible conductive material that completely fills the space between the contact pad on the IC package and the contact pad on the PCB when sufficient pressure is applied to the top of the IC package.
		While the interconnecting array is typically a separate component sitting inside the LGA IC alignment socket along with the LGA IC, the alignment socket and the interconnecting array may alternatively be a single integrated unit.
		The present methods of connecting LGA IC packages to printed circuit boards are also subject to force tolerance problems associated with the compression of the conductors in the interconnecting array by the LGA package.
	freepatentsonline.com /5473510.html (3634 words)

	Universal land grid array socket engagement mechanism - Patent 6191480
		Both embodiments reduce stress and provide a land grid array engagement mechanism which is readily removable and which also provide a central opening or central portion access to chip module components for purposes of cooling such as by providing direct attachment to heat sinks or indirect attachment to heat sinks through heat spreaders.
		The land grid array interconnection system is one that is widely requested and is a highly desirable mechanism for engagement between electronic circuit components and underlying sockets for mechanical and electrical interconnection.
		Since the land grid array interconnection mechanism is largely targeted for leading edge and high performance, high thermal stress modules, this limitation in thermal performance is very desirable particularly in modules that generate significant amounts of heat.
	www.freepatentsonline.com /6191480.html (2392 words)

	Land grid array sockets for server applications
		Depending on the specific LGA technology, additional mechanical components (such as those required to align the components and those required to generate the compression force) are required to complete the assembly.
		Spring fingers, which are typically integrated into the socket interposer, serve to register the contact array on the LGA module to the array in the socket interposer.
		The loading pattern on the LGA module consists of an essentially uniform upward-acting load distribution on the bottom of the module in the vicinity of the contact array.
	www.research.ibm.com /journal/rd/466/corbin.html (7088 words)

	Multi-chip land grid array carrier - Patent 6097611
		A land grid array (LGA) carrier includes an interposer having a first surface and a second surface opposite the first surface, with a plurality of locations on the first surface adapted to receive a plurality of semiconductor dice and passive components.
		In one aspect of the invention, a land grid array (LGA) carrier includes an interposer having a first surface and a second surface opposite the first surface, with a plurality of locations on the first surface adapted to receive a plurality of semiconductor dice and passive components.
		The LGA carrier 10 includes an interposer 12, which in one embodiment of the invention is fabricated out of organic advanced circuit board material, as is known in the art.
	www.freepatentsonline.com /6097611.html (2782 words)

	HID land grid array packaged device having electrical and optical - US Patent 6707124 (Site not responding. Last check: 2007-10-04)
		There are multiple rows or an array of lower bond pads along the bottom surface of the substrate (not shown) which reduces the area of the device's footprint as compared to devices with the traditional tabs or lead frames.
		The land grid array device has higher heat dissipation characteristics than existing devices because the device is directly attached to the package's external material.
		In addition, the land grid array device is easy to align since the solder balls, bumps or electrical pads may be used to align the package.
	www.patentstorm.us /patents/6707124.html (7955 words)

	Solderless optical transceiver interconnect - Patent 6325552
		A metallized particle interconnect or equivalent array interfaces a land grid array on the optics device with a land grid array on the PCB.
		Note that the distance 62 between the surface of land grid array 36 of optics device 24 and the base of integrated heat sink element 32 which contacts PLB substrate 12 define the amount of compression to be experienced by micro columns 50.
		At 78 the metallized particle interconnect array is aligned with the land grid array (LGA) on the PLB.
	www.freepatentsonline.com /6325552.html (2891 words)

	PC-nonlinear FEA makes the connection - 9/18/2000 - Design News - CA108014 (Site not responding. Last check: 2007-10-04)
		This system can be used to test several different grid arrays without having to solder the device to the pc board.
		The Z-Beam contact is press-fit into a plastic grid array, which acts as the interface between the pc board and LGA.
		A common application uses the socket, LGA device, and a frame with lid to terminate the device to the pc board.
	www.designnews.com /article/CA108014.html (1823 words)

	BGA sockets LGA CSP Ball Grid Array Land Grid Array Chip Scale BGA socket
		BGA Sockets, BGA socket LGA socket CSP socket
		Such packages are referred to as Land Grid Arrays (LGA) (see datasheet 23021) also available (contact us and request test results on 25Pin LGA,).
		LGA sockets can be manufactured for spring movement of.015" (0.4 mm), which "takes up the slack" when there is a problem with co-planarity on the bottom of the device.
	www.larsenassociates.com /BGA-LGA-CSP2.html (1537 words)

	[No title]
		For years, pin grid arrays (PGAs) have been used for advanced, large I/O devices, such as the 80486 processor, and they still are.
		But now, the ball grid array (BGA), the surface mount variety of area array packages, is the package of choice for these devices (Fig.
		Land grid array (LGA) and solder column array packages are related to BGAs.
	www.reed-electronics.com /SEMICONDUCTOR/index.asp?layout=articlePrint&articleID=CA167351 (2454 words)

	Glossary (Site not responding. Last check: 2007-10-04)
		Designed by Motorola, the land grid array is basically pin-grid array with solder bumps instead of leads.
		An interconnected array of active and passive components, which are capable of performing a complete circuit function, fabricated on a single crystal of semiconductor material (usually silicon).
		A large chip carrier package which can have 28 pins or more (typically based on a grid of 0.100-inches) protruding from one flat surface, for through-hole connection to a printed circuit board.
	www.emulation.com /catalog/glossary.html (951 words)

	Glossary of Printed Circuit Design and Manufacturing
		A flip-chip type of package in which the internal die terminals form a grid-style array, and are in contact with solder balls (solder bumps), which carry the electrical connection to the outside of the package.
		The PCB footprint will have round landing pads to which the solder balls will be soldered when the package and PCB are heated in a reflow oven.
		Advantages of the ball grid array package are (1) that its size is compact and (2) its leads do not get damaged in handling (unlike the formed "gull-wing" leads of a QFP') and thus has a long shelf life.
	www.goldengategraphics.com /pcgloss.htm (9643 words)

	Processors - Package Type Guide (Desktop Processors)
		LGA (LAND Grid Array) refers to how the processor die is attached to the substrate. The number 4 stands for the revision number of the package.
		PGA is short for Pin Grid Array, and these processors have pins that are inserted into a socket.
		PPGA is short for Plastic Pin Grid Array, and these processors have pins that are inserted into a socket.
	support.intel.com /support/processors/sb/CS-009863.htm (880 words)

	HDI land grid array packaged device having electrical and optical interconnects - US Patent 6274391 (Site not responding. Last check: 2007-10-04)
		A high density interconnect land grid array package device combines various electronic packaging techniques in a unique way to create a very thin, electrically and thermally high performance package for single or multiple semiconductor devices.
		The method of claim 1, wherein said electrically conductive pads on a layer of said thin film overlay facing away from said semiconductor device are patterned into a ball grid array.
		The method of claim 11, wherein said solder balls are used as an alignment mechanism for aligning an external optical receiver and/or transmitter to said device's optical receiver and/or transmitter.
	www.patentstorm.us /patents/6274391.html (8137 words)

	Solid State Technology - Advanced IC packaging: Markets and trends
		Land grid array packages are essentially BGA packages without the solderballs.
		The first CSPs were modeled after the array style of the BGA, but the earliest CSP developed was the flex CSP, not BT resin.
		Total substrate revenues encompass the area contributed by pin grid array (PGA), as well as by BGA and CSP packages.
	sst.pennnet.com /Articles/Article_Display.cfm?Article_ID=97193 (1385 words)

	Chip Scale Review Online
		The substrate is a double-sided FR-4/5 (or the equivalent) with traces on one side connected with through-vias to the land grid pad pattern on the bottom side.
		With this type of chip, the traces are fanned into the center of the package and then connected with plated-through holes to the land grid pattern on the bottom surface.
		The solder mask, applied to the LGA pad surface, can overhang the pads or may be patterned so that the openings are slightly larger than the pads.
	www.chipscalereview.com /issues/0900/patents.html (702 words)

	SMTA - The Surface Mount Technology Association
		Abstract : For land grid array (LGA) packages, there are no solder balls on the package soldering pads.
		In this paper, the finite element method was used to examine the effects of pad size and stencil thickness on the stress and strain distributions in the solder joints of LGAs.
		Two types of pad, dogbone pad and blind via pad, were designed with two different soldering pad diameters in each case for the assembly of a land grid array chip scale package (CSP) with 284 I/Os.
	www.smta.org /knowledge/proceedings_abstract.cfm?PROC_ID=85 (354 words)

	LGA Sockets - cLGA Land Grid Array socket systems
		The InterCon cLGA® land grid array socket system was designed to bring conventional connector material construction to a high performance, low cost socket design.
		Full qual report on the industry's only LGA socket system that is qualified to both the EIA-540BOAE and Telcordia GR-1217-CORE specs.
		socket is a low cost, high volume, high speed, fully qualified chip-to-board, board-to-board, and flex-to-board solution for land grid array applications.
	www.lgasockets.com (153 words)

	Actel Introduces Land Grid Array Packaging Option for Radiation-Tolerant RTAX-S FPGA Family (Site not responding. Last check: 2007-10-04)
		In combination with Actel's RTAX-S FPGAs, the LGA package, is particularly well suited for mission-critical applications in the military and aerospace industries.
		With the availability of Actel's new LGA package, customers can buy the LGA-packaged products and store them for extended periods of time, attaching the columns or solder balls when the part is actually needed for design implementation.
		The LGA package is now available for all RTAX-S devices offered in ceramic column grid array (CCGA) packaging, including RTAX1000S and RTAX2000S devices.
	www.actel.com /company/press/2005pr/RTAX-S_LGA.html (547 words)

	LGA - Land Grid Array, Leadless Grid Array
		LGA - Land Grid Array, Leadless Grid Array
		Land Grid Array is not the only word formed from LGA.
		Every attempt has been made to provide you with the correct acronym for LGA.
	www.auditmypc.com /acronym/LGA.asp (113 words)

	X-bit labs - Hardware news - AMD Heading Towards Land-Grid Array Sockets — Report.
		While the LGA packaging provides numerous benefits to AMD, mainboards with such a socket will cost more to be made.
		While earlier some unofficial sources assumed that the Socket F would have 1206 or 1207 pins, it was generally thought that the Socket F will use conventional socketing mechanism with pins located onto the central processing unit’s (CPU’s) packaging.
		However, it seems that AMD decided to use LGA casing for the future chips, as LGA typically provides both a high density range and interface wipe for a reliable, long-term electrical connection from the microprocessor to the printed circuit board, according to sockets manufacturer Tyco Electronics.
	www.xbitlabs.com /news/cpu/display/20051109121151.html (450 words)

	Business Wire: STATS Expands Wireless Solutions Offering with ... @ HighBeam Research (Site not responding. Last check: 2007-10-04)
		The LGA is a laminate substrate-based, fine pitch chip scale package with plastic over molded encapsulation.
		The LGA's size range of 4mm x 3mm to 9mm x 9mm is a popular choice for wireless and mixed signal applications and adheres to the JEDEC MO-222 standard.
		STATS also offers advanced assembly services and has developed a wide array of traditional and advanced leadframe and laminate based products, including various ball grid array packages to serve some of the world's technological leaders.
	www.highbeam.com /library/doc0.asp?docid=1G1:99179674&refid=ink_tptd_np (564 words)

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