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| | sop.html |
 | | The SOP paradigm moves packaging design to early phases of system design including chip/package functionality partitioning and integration, which is a paradigm shift from today's system-level, or ASIC, or packaging design. |
 | | The typical electronics product/system of the future is expected to include the following --- Digital Processors, Digital Signal Processors, Memories and ASICs, Busses and Interconnect, Peripherals and Interface Devices, Analog Baseband Front Ends, RF and Microwave Processing Stages, Discrete Components (R, L, C), Micro-Electro-Mechanical (MEMS) Components, Displays, User Interfaces, and associated logic. |
 | | Electronics is one of the world's largest industries, accounting for almost 1 Trillion dollars worldwide. |
| users.ece.gatech.edu /~vkm/sop.html (195 words) |
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