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Topic: Physical vapor deposition

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	Physical vapor deposition target constructions - Patent 6797362
		The physical vapor deposition target construction of claim 1 wherein the maximum dimension of the predominate portion of the grains in the target material is from about 30 microns to less than 100 microns.
		The physical vapor deposition target construction of claim 7 wherein the maximum dimension of the predominate portion of the grains in the target material is from about 30 microns to less than 100 microns.
		The physical vapor deposition target assembly of claim 14 wherein the maximum dimension of all of the grains in the aluminum material of the target is from about 30 microns to less than 100 microns.
	www.freepatentsonline.com /6797362.html (4113 words)

	Thermal physical vapor deposition source using pellets of organic material for making OLED displays - Patent 6837939
		The thermal physical vapor deposition source of claim 1 further including means engageable with pellets in the spaced passages for adjusting the position of the pellets to compensate for material loss during vaporization.
		The thermal physical vapor deposition source of claim 12, wherein the electrical heater structure includes an electrically conductive heater plate, over the cover plate, having a second plurality of openings, each of the openings corresponding to each of the first plurality of openings of the cover plate and the spaced passages of the housing.
		The thermal physical vapor deposition source of claim 12, wherein the apertures of the aperture plate are selected to have different cross-sectional areas to produce different flow rates and patterns of vapor efflux.
	www.freepatentsonline.com /6837939.html (7197 words)

	Source for thermal physical vapor deposition of organic electroluminescent layers patent invention
		In the deposition process, the deposition material is heated to the point of vaporization and the vapor of the deposition material is condensed on the substrate to be coated after the deposition material is moved out of the deposition source.
		The substrate 12 to be coated with the organic electroluminescent layers is mounted to an upper plate 13-1 of the chamber 13, and the deposition source 10 to have a deposition material 20 (organic material) is mounted on a thermally insulating structure 14 fixed to a bottom wall 13-2 of the chamber 13.
		The vapor of vaporized deposition material 20 is moved along the surface of the baffle 11B and deposited on the substrate 12 (in FIG.
	www.freshpatents.com /Source-for-thermal-physical-vapor-deposition-of-organic-electroluminescent-layers-dt20060316ptan20060054089.php (1710 words)

	Physical vapor deposition chamber having an adjustable target patent invention
		PVD is a plasma process performed in a vacuum chamber where negatively biased target (typically, a magnetron target) is exposed to a plasma of an inert gas having relatively heavy atoms (e.g., argon (Ar)) or a gas mixture comprising such inert gas.
		During film deposition in the PVD chamber 100, the rotational motion of the substrate pedestal 126 compensates for such spatial non-uniformity of the flux of the sputtered material and deposit, on the rotating substrate 130, highly uniform films.
		For example, the PVD chamber 400 where the target assemblies 410A-410D comprise targets 118 formed from different materials may be used to deposit in-situ multi-layered film stacks of highly uniform films of such materials or their mixtures.
	www.freshpatents.com /Physical-vapor-deposition-chamber-having-an-adjustable-target-dt20060511ptan20060096851.php?type=description (3576 words)

	Physical Vapor Deposition by Evaporation
		In PVD by sputtering, the material to be deposited as a film is converted into vapor by bombarding the source material with high-energy particles or ions.
		In PVD by evaporation, the conversion into vapor phase is achieved by applying heat to the source material, causing it to undergo evaporation.
		Vapor pressure greater than 1.5 Pa is needed in order to achieve deposition rates which are high enough for manufacturing purposes.
	www.siliconfareast.com /evaporation.htm (317 words)

	Physical Vapor Deposition PVD - Surface Finishing - Engineer's Handbook (Site not responding. Last check: 2007-11-04)
		It is fundamentally a vaporization coating process in which the basic mechanism is an atom by atom transfer of material from the solid phase to the vapor phase and back to the solid phase, gradually building a film on the surface to be coated.
		PVD can be applied using a wide variety of materials to coat an equally diverse number of substrates using any of the three basic PVD technologies to deposit a number of desired finishes of variable thickness with specific characteristics.
		PVD is a desirable alternative to electroplating and possibly some painting applications because it generates less hazardous waste and uses less hazardous materials (i.e., no plating baths).
	www.engineershandbook.com /MfgMethods/PVD.htm (656 words)

	Ionized Metal Physical Vapor Deposition (Site not responding. Last check: 2007-11-04)
		Hence, magnetron ionized metal physical vapor deposition (IMPVD) can produce highly ionized metal fluxes that can be used to fill high-aspect-ratio vias and trenches in microelectronic devices.
		Uniformity, magnitude, and ionization fraction of the depositing fluxes are the response variables.
		The influence of the design variables on the response variables is examined, with the goals of obtaining high uniformity, high magnitude, and high ionization fraction of the depositing metal fluxes.
	uigelz.ece.iastate.edu /Projects/IMPVD/impvd.html (234 words)

	Physical Deposition of YBCO (Site not responding. Last check: 2007-11-04)
		Atoms are vaporized from yttrium, barium and copper ingots by a high-energy electron beam, and the vapor jets proceed through the low-pressure chamber toward a deposition substrate.
		The atoms that vaporize from the surfaces of the yttrium, barium and copper ingots, at the bottom of the figure, quickly undergo expansion in the deposition chamber that results in a rapid decrease of the number density.
		Therefore the possibility of the atoms to transport from the vaporized ingot surface to the substrate is increased by the atomic collisions.
	www.engin.umich.edu /labs/cfd/research/NGPD/ybco (654 words)

	Physical vapor deposition (Site not responding. Last check: 2007-11-04)
		Physical vapor deposition methods are clean, dry vacuum deposition methods in which the coating is deposited over the entire object simultaneously, rather than in localized areas.
		PVD methods differ in the means for producing the metal vapor and the details of plasma creation.
		The primary PVD methods are ion plating, ion implantation, sputtering, and laser surface alloying.
	www.corrosion-doctors.org /MetalCoatings/physical.htm (92 words)

	Physical Vapor Deposition (Site not responding. Last check: 2007-11-04)
		The basic idea behind physical vapor deposition (PVD) is the physical change of state of the material that is being deposited (target material).
		PVD is carried out at high vacuum in a chamber consisting of the target and the wafers.
		The vaporized material is deposited onto the surface of the wafer in a similar process to Chemical Vapor Deposition.
	www.rpi.edu /dept/materials/COURSES/NANO/nugent/pvd.html (189 words)

	Physical Vapor Deposition/Metal Deposition/e-Beam/Filament Evaporator/Quartz Crystal Monitor/Step Coverage (Site not responding. Last check: 2007-11-04)
		The vapor pressure of a liquid is the pressure exerted by its vapor when the liquid and vapor are in dynamic equilibrium.
		The boiling point is the temperature at which the vapor pressure of a liquid equals the external pressure.
		When the vapor source is heated, the vapor pressure of the metal to be evaporated becomes substantial.
	www.ee.byu.edu /cleanroom/metal.phtml (1753 words)

	RGB-133R Physical Vapor Deposition - Updated Edition (Site not responding. Last check: 2007-11-04)
		The goal of physical vapor deposition (PVD) is to impart specific properties to a surface to change or alter its characteristics.
		According to a soon-to-be-released updated report RGB-133R Physical Vapor Deposition (PVD) from Business Communications Co., Inc., (www.bccresearch.com),the value of worldwide shipments of PVD equipment, materials deposited and PVD services was estimated at $4,702.8 million, $968.4 million and $949.5 million in 2004, respectively.
		PVD equipment will remain the largest market as sales increase from a current estimated level of $5.2 billion to $8.4 billion by 2010 at an AAGR (average annual growth rate) of 10.2% through the forecast period.
	www.bccresearch.com /editors/RGB-133R.html (624 words)

	SURFACE COATING BY PHYSICAL VAPOR DEPOSITION
		It is fundamentally a vaporization coating process in which the basic mechanism is an atom by atom transfer of material from the solid phase to the vapor phase and back to the solid phase, gradually building a film on the surface to be coated.
		In the case of reactive deposition, the depositing material reacts with a gaseous environment of co-deposited material to form a film of compound material, such as a nitride, oxide, carbide or carbonitride.
		PVD can be applied using a wide variety of materials to coat an equally diverse number of substrates using any of the three basic PVD technologies to deposit a number of desired finishes of variable thickness with specific characteristics.
	p2library.nfesc.navy.mil /P2_Opportunity_Handbook/1_5.html (854 words)

	Physical vapor deposition poly-p-phenylene sulfide film as a bottom anti-reflective coating on polysilicon - Patent ...
		It is an object of the present invention to provide a method for patterning a conductive layer, such as polysilicon or polycide, using a BARC layer formed by a Physical Vapor Deposition (PVD) technique using Poly-p-phenylene sulfide (PPS).
		The invention is a method for forming Poly-p-phenylene sulfide (PPS) using Physical Vapor Deposition (PVD) as a bottom anti-reflective coating (BARC) over a conductive layer 26 and patterning /etching the conductive layer 26.
		The Poly-p-phenylene sulfide (PPS) layer is preferably formed using a Physical Vapor Deposition (PVD) process comprising heating and evaporating a Poly-p-phenylene sulfide (PPS) source at a crucible temperature in a range of between about 250 and 500.degree.
	www.freepatentsonline.com /6063547.html (3778 words)

	Physical Vapour Deposition
		During physical vapour deposition (PVD), a thin film is grown with the atomic species taken part in the growth – atoms, molecules, radicals and/or ions – being deposited from the vapour phase.
		Among the numerous PVD techniques available, thermal evaporation, magnetron sputtering and pulsed laser deposition (PLD) are some of the most frequently used techniques.
		The deposition flux is controlled by the temperature, while the energy of the atomic species corresponds to thermal energies and cannot be changed.
	www.inano.dk /sw263.asp (424 words)

	Physical Vapour Deposition (PVD) - An Introduction
		Physical vapour deposition (PVD) is fundamentally a vaporisation coating technique, involving transfer of material on an atomic level.
		During this stage, a target, consisting of the material to be deposited is bombarded by a high ebergy source suchg as a beam of electrons or ions.
		As mentioned previously, PVD coatings are generally used to improve hardness, wear resistance and oxidation resistance.
	www.azom.com /details.asp?ArticleID=1558 (453 words)

	Physical Vapor Deposition Technique for Growing Nanostructures
		The basic process of this method is sublimating source material(s) in powder form at high temperature, and a subsequent deposition of the vapor in a certain temperature region to form desired nanostructures.
		The vapor is then carried by the innert carrying gas down to the lower temperature region, where the vapor gradually becomes supersaturated.
		The thermal evaporation process is basically a physical vapor deposition process and has been successfully used for synthesizing a variety of oxide and non-oxide nanobelts and nanowires.
	www.nanoscience.gatech.edu /zlwang/research/pvd.html (442 words)

	Physical vapor deposition (Site not responding. Last check: 2007-11-04)
		This technique is based in the formation of vapor of the material to be deposited as a thin film.
		Alternatively, it is possible to use the ion source to directly bombard the substrate surface during the evaporation process, to impart a higher energy to the evaporated atoms and achieve a film with better properties (adherence, density, etc.).
		This technique, called 'ion beam assisted deposition' or IBAD, is also available at the laboratory and has been conveniently used to deposit carbon films (DLC) and binary and ternary compounds of the carbon-boron-nitrogen family.
	www.icmm.csic.es /fis/english/pvd.html (156 words)

	Physical Vapor Deposition (PVD)
		The goal of PVD is to impart specific properties to a surface to change or alter its characteristics.
		The value of worldwide shipments of PVD equipment is estimated to be 5.2 billion by 2005 and is forecast to rise at an average annual growth rate (AAGR) of 10.1%, and reach $8.4 billion by 2010.
		The value of materials deposited will reach $1.1 billion in 2005 and is expected to rise at an AAGR of 11.1% to $1.8 billion by 2010.
	www.marketresearch.com /redirect.asp?productid=1170884&progid=3603 (447 words)

	Physical Vapor Deposition of Thin Films
		With electronic, optical, and magnetic coating technologies assuming ever-increasing importance in the high-tech industries, there is a growing need for expertise in physical vapor deposition of thin films.
		Physical Vapor Deposition of Thin Films presents a unified treatment of the theories, data, and technologies which are critical to this field.
		Specific topics include thermal evaporation, sputtering, and pulsed laser deposition methods; trends in sputter yield data and a new simplified collisional model of sputter yield for pure element targets; quantitative models for film deposition rate, thickness profiles, and thermalization of the sputtered beam; and more.
	www.polysurfacesbookstore.com /pages/3688.html (256 words)

	PVD Coatings, TiN, Titankote, Physical Vapor Deposition - Richter Precision Inc.
		Physical Vapor Deposition, or PVD, is a term used to describe a family of coating processes.
		The most common of these PVD coating processes are hollow cathode reactive ion plating, cathodic arc deposition, and magnetron sputtering.
		This also means that PVD coatings can reduce the tendency of materials to adhere: this reduces friction and allows for more unrestricted movement.
	www.richterprecision.com /PVD_coatings.htm (1241 words)

	"Seedless" electrochemical deposition of copper on physical vapor deposition-W2N liner materials for ultra ... (Site not responding. Last check: 2007-11-04)
		Typically, a diffusion barrier layer is deposited by the physical vapor deposition (PVD) technique into features that have already been created in the wafer.
		Vapor deposition techniques are problematic for producing uniform copper seed layers in high aspect ratio features.
		Several techniques are being developed to eliminate the copper seed layer altogether, so as to deposit directly on the conductive metal nitride diffusion barrier materials.
	www.findarticles.com /p/articles/mi_qa3776/is_200112/ai_n9008602 (857 words)

	PVD Coating, Physical Vapor Deposition,Gold plating solution,OIL RUBBED BRONZE,pvd,ORB,Thin film coatings,Brass ...
		Centrally located in southern California, PVD Coatings is a 5 million dollar state of the art PVD coating center offering the highest quality thin film coatings for a variety of decorative and functional applications.
		Physical Vapor Deposition (PVD) is an environmentally friendly vacuum coating process that provides brilliant and durable decorative finishes on household appliances, plumbing fixtures, door hardware, jewelry, electronic components, automotive trim and marine fittings.
		The second PVD system also utilizes the cathodic arc principle with a different target configuration and provides high volume through put along with an efficient parts transfer and handling system.
	www.pvdcoatings.net (308 words)

	Apparatus and method for multi-target physical-vapor deposition of a multi-layer material structure using target ...
		An apparatus and method for depositing plural layers of materials on a substrate within a single vacuum chamber allows high-throughput deposition of structures such as those for GMR and MRAM application.
		In alternative embodiments, plural substrates may be aligned sequentially with plural targets to allow simultaneous deposition of plural structures within the single vacuum chamber.
		An apparatus for physical-vapor deposition of a multi-layer material structure onto a substrate, the material structure having plural material layers deposited according to a predetermined sequence, each layer comprised of one of the plural materials, the apparatus comprising:
	www.delphion.com /details?pn10=US06051113 (572 words)

	Physical Vapor Deposition Processes. - Products Finishing - HighBeam Research
		Mattox, Donald M. There are four types of physical vapor deposition processes: vacuum evaporation; sputter deposition; arc vapor deposition and ion plating.
		In physical vapor deposition (PVD) processes, atoms or molecules are vaporized from a solid or liquid source, transported in the form of a vapor through a vacuum or low-pressure gaseous environment and condensed on a substrate.
		PVD processes can be used to deposit films of elemental, alloy and compound materials as well as some polymeric materials.
	www.highbeam.com /doc/1G1-78786365.html?refid=ip_hf (146 words)

	Physical Vapor Deposition by Sputtering
		is a term used to refer to a physical vapor deposition (PVD) technique wherein atoms or molecules are ejected from a target material by high-energy particle bombardment so that the ejected atoms or molecules can condense on a substrate as a thin film.
		A complete theory on how sputtering occurs has not yet been established due to the complexity of interactions involved, but experts in the field state that sputtering is comparable to billiard ball kinetics in three dimensions.
		Sputtering yield, or the number of atoms ejected per incident ion, is an important factor in sputter deposition processes, since it affects the sputter deposition rate.
	www.siliconfareast.com /sputtering.htm (409 words)

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