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Topic: Plastic grid array

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Pin grid array

PGA

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	Pin grid array - Wikipedia, the free encyclopedia
		The pin grid array or PGA is a type of packaging used for integrated circuits, particularly microprocessors.
		On a PGA, the integrated circuit (IC) is mounted in a ceramic slab of which one face is covered, or partially covered, in a square array of metal pins.
		The plastic pin grid array (PPGA) and later flip-chip pin grid array (FCPGA) versions were both created by Intel Corporation for their Pentium processors, and are often used on motherboards with ZIF (Zero Insertion Force) sockets to protect the delicate pins.
	en.wikipedia.org /wiki/Pin_grid_array (191 words)

	Icepak - Plastic Ball Grid Array Characterization
		The 119 PBGA (Plastic Ball Grid Array) package, mounted on a PCB (printed circuit board) in forced flow conditions, is cooled via conjugate (combined conduction and convection) heat transfer.
		Plastic ball grid array with inlet flow of 1 m/s.
		Plastic ball grid array with inlet flow of 2 m/s.
	www.icepak.com /prod/icepak/bmark/icebma06.htm (243 words)

	NEPP - Ball Grid Array (BGA) (Site not responding. Last check: 2007-10-23)
		Column grid array (CGA or CCGA) is similar to BGA except it uses column interconnects instead of balls.
		A 360 I/O plastic BGA used in the MER IMU (inertial measurement unit, a commercial gyro) is also being considered for qualification.
		The interconnections of plastic BGA mounted to polymeric circuit boards are generally more reliable under thermal cycling when compared to ceramic BGA packages mounted to polymeric circuit boards.
	nepp.nasa.gov /index_nasa.cfm/773 (777 words)

	Spectrum Semiconductor Materials: Plastic Pin Grid Array (PPGA)
		Plastic Pin Grid Arrays were first developed in 1993 to combat power supply decoupling issues in high-performance microprocessors.
		This square chip packaging technology was designed for microprocessors with greater numbers of transistors on each chip than previous models.
		Unlike ceramic pin grid arrays (CPGA) the PPGA package offers a greater amount of thermal resistance, improved electrical performance and power distribution.
	www.spectrum-semi.com /products/ppga.html (82 words)

	Ball Grid Array Reliability
		Motorola developed the first plastic ball grid array packages for computer and portable electronics applications, and similar packaging concepts are now being used by all of the major semiconductor suppliers.
		DaimlerChrysler has developed a 35 mm multi-chip plastic ball grid array package that is now in volume production for under-the-hood applications.
		However, in order to meet reliability goals, a thicker substrate was required for the BGA inter-poser board, and only the outermost two rows of solder balls in the large BGA component are being used for I/O during operation.
	www.eng.auburn.edu /ee/cave/bga.htm (338 words)

	Glossary Search Results
		PGA (Pin Grid Array) - A form of chip with a group of pins in concentric rectangles, designed to fit into a PGA slot.
		Plastic Pin Grid Array (PPGA) - The PPGA form factor, also referred to as socket 370, was created by Intel to offer a lower cost alternative to its Slot 1 packaging.
		It exemplified the first big move back to sockets after L2 caches were embedded in the processor die and cartridges with the chip and separate L2 cache were no longer needed.
	www.geek.com /glossary/glossary_search.cgi?p (8791 words)

	FlxI/O (Flip Chip Plastic Ball Grid Array) (Site not responding. Last check: 2007-10-23)
		The Flip Chip Plastic Ball Grid Array – FlxI/O™ Flip Chip package is LSI Logic's third generation flip chip packaging technology.
		This approach is also known as Area Array I/O or Core I/O. Solder bumps on the active surface of the die are used to connect to the substrate.
		An array of solder balls on the package fastens to the host circuit board while providing a low inductance electrical path to this board.
	www.lsilogic.com /products/flxi_o (291 words)

	ACRO.IT: PPGA - Plastic Grid Pin Array - Intel (
		ACRO.IT: PPGA - Plastic Grid Pin Array - Intel (
		In no event shall ACRO.IT be liable for any special indirect or consequential damages or any damages whatsoever resulting from loss of income or profits, whether in an action of contract, negligence or other tortious action, arising in connection with the use or performance of the information on ACRO.IT web site.
		PPGA plastic grid pin array - intel (,acronym,directory,dictionary,acronym,directory,dictionary,acronym,directory,dictionary,acronym,directory,dictionary,acronym,directory,dictionary,acronym,directory,dictionary,acronym,directory,dictionary,
	www.acro.it /PPGA.html (181 words)

	What is PPGA? - a definition from Whatis.com - see also: plastic pin grid array
		PPGA (plastic pin grid array) is a microchip design from Intel that has the silicon core of the microchip facing down toward the computer motherboard.
		The core is covered by a heat slug, which helps to dissipate the heat to the heatsink.
		The PPGA chip is less expensive to manufacture that the slot-based chip, which is why PPGA chips are used in sub-$1000 desktop computers.
	whatis.techtarget.com /definition/0,,sid9_gci557328,00.html (261 words)

	Ball Grid Array Technology: White Electronic Designs -
		We provide a comprehensive array of services including ball grid array (BGA) assembly.
		Ball grid array packaging is a method for reducing package size and integrating a greater number of functions on a single memory chip module.
		For more information about ball grid array assembly from WEDC, please follow this link: Ball Grid Array Technology.
	www.wedc.com /ball-grid-array.htm (314 words)

	Intel(R) Pentium(R) Processor - Hardware Design Support FAQ
		The embedded family includes the following Pentium processors: the 100 MHz, 133 MHz, 133 MHz with VRT (Voltage Reduction Technology), and 166 MHz in SPGA (Ceramic Pin Grid Array).
		These embedded processors are available in a surface-mountable 352-ball HL-PBGA (high thermal, low profile, plastic ball grid array) package, as well as a 296-pin PPGA package.
		Plastic Pin Grid Array processors, such as the Pentium processor with MMX technology (FV8050366233), cannot be soldered directly onto a board.
	developer.intel.com /design/support/faq/embed_proces/pentium.htm (453 words)

	pbga (Site not responding. Last check: 2007-10-23)
		The Plastic Ball Grid Array (PBGA) is a high density surface mount package for low stress operating environments.
		The package includes BT Laminate base, plastic overtnolded body and tin-lead solder balls.
		With the thermal vies connected to a ground plane of the PCB, in its application, the FPBGA has superior thermal performance.
	www.amis.com /tech_resources/packaging/pbga.html (60 words)

	Tanner Manuflex Manufacturing Services - Packaging
		Our packaging experience is based in plastic and ceramic with complete mil-standard certification.
		At Manuflex we offer: wafer level gold bumping, inner lead TAB bonding, plastic, and ceramic packaging.
		Plastic package configurations include, but are not limited to, the following: DIP, SOIC, PLCC, PQFP with heat spreader/slug options, TQFP, BGA, TSOP, SSOP, and PGAs (and most configurations are available in ceramic equivalents).
	www.tanner.com /manuflex/services/packaging.htm (109 words)

	Spectrum Semiconductor Materials: Ceramic Pin Grid Array (PGA) (Site not responding. Last check: 2007-10-23)
		Ceramic Pin Grid Array Packages offer high I/O signal carrying capacity, excellent electrical performance and high thermal heat dissipation, with minimum package size.
		This through-hole mount package is typically square in shape with gold-plated pins brazed in a matrix pattern to the bottom or top of the package.
		These packages are PPGA's or Plastic Pin Grid Arrays.
	www.spectrum-semi.com /products/cpga.html (124 words)

	PGA means one of the following things Professional Golfers...
		PGA means one of the following things Professional Golfers...
		The PGA TOUR PGA TOUR, the principal men's professional golf tour in the United States
		pin grid array pin grid array, a type of packaging for integrated circuit integrated circuits
	www.biodatabase.de /PGA (177 words)

	Intel Awards Coveted Supplier Continuous Quality Improvement Award (Site not responding. Last check: 2007-10-23)
		Ibiden Company, Ltd., provides plastic pin grid array packages.
		Dexter Electronic Materials provides Intel with plastic pin grid array packages.
		Shinko Electric Industries Co., Ltd., supplies plastic and leadframe packaging as well as assembly subcontracting to Intel.
	www.intel.com /pressroom/archive/releases/CN32698C.HTM (515 words)

	ACA-Glossary (Site not responding. Last check: 2007-10-23)
		Micro Ball Grid Array; developed by Tessera Corp. µBGA is a registered trademark of Tessera Corp.
		A functional collection of stand alone blocks of silicon in either "bare" die form or some other surface-mountable micro packaging, mounted on various substrates from printed circuit boards to ceramic and thin film structures and delivered as a highly integrated module.
		A term used to describe a package whose leads or terminals are attached to the surface of the PC board with solder paste.
	www.ewh.ieee.org /mm/cpmt/adhesives/aca_glos.html (597 words)

	PBGA Plastic Ball Grid Array Practical Dummy Components
		Plastic Ball Grid Array (PBGA) packages are designed for low inductive, improved thermal operation and enhanced SMT ability.
		PBGA packages are ideal for microprocessors/controllers, ASICs, gate arrays, memory, DSPs and PC chip set applications.
		PBGA Plastic Ball Grid Array (1.5mm / 1.27mm Pitch)
	www.practicalcomponents.com /pbga.htm (248 words)

	ClubOC - We overclock just because we can! (Site not responding. Last check: 2007-10-23)
		This package differs from the S.E.C. Cartridge as this processor has no external plastic cover, thermal plate, or latch arms.
		All the Intel Celeron processors are available in the plastic pin grid array (PPGA) package.
		The PPGA package is compatible with the 370 pin socket and provides more flexibility to design low cost systems by enabling lower profile and smaller systems and providing the potential for reducing costs of processor retention and cooling solutions.
	www.cluboverclocker.com /guides/celery_info/celeron_info.htm (558 words)

	Packaging
		Our packaging experience is based in plastic, ceramic and TAB packaging.
		AMIS is supported through strategic alliances with subcontract assembly manufacturers throughout North America and Asia.
		AMIS is committed to environmentally friendly solutions and offers both RoHS and Green compliant packaging.
	www.amis.com /tech_resources/packaging (128 words)

	Plastic Pin Grid Array from FOLDOC (Site not responding. Last check: 2007-10-23)
		The Plastic Pin Grid Array packaging is similar to that used on Pentium processors.
		The silicon core is covered by a heat slug that faces down toward the motherboard.
		Celeron processors are also available in Slot 1 SEPP packaging.
	foldoc.org /?PPGA (102 words)

	Value Added Services
		A semiconductor chip that is flipped (face down) and connected for package, substrate or board.
		The chip typically has bumps (on the bond pads) in a peripherial or array design.
		Micro Ball Grid Array developed by Tessera Corp.
	www.valueaddedservices.net /glo.htm (316 words)

	Re: gEDA-user: Plastic Ball Grid Array (PBGA) packages?
		This idea seems very similar to the tool I described.
		With grids of 1mm (.8mm already) or less I get nervouse about being off by a row.
		The capilary effect will help twist the part into alignment but I don't think it will cause the device to shift a row.
	ftp.sunet.se /geda/mailinglist/geda-user25/msg00121.html (845 words)

	Package Information Page
		SOT881-1; plastic ball grid array package; 292 balls; body 27 x 27 x 1.55 mm
		On this page you can find the package outline drawing and soldering information of this package.
		plastic ball grid array package; 292 balls; body 27 x 27 x 1.55 mm
	www.vlsi.com /package/SOT881-1.html (45 words)

	NEC Offers Gate Array SoC
		The family is targeted at customers using 30,000 to 200,000 units per year in a wide variety of applications.
		After board-level verification, SoCLite designs can be implemented in a single gate-array device with NEC's 0.35-micron drawn ASIC technology.
		The SoCLite custom controller device is available in production volumes in a 256-pin plastic ball grid array (PBGA).
	www.embedded.com /shared/printableArticle.jhtml?articleID=9900383 (159 words)

	PBGA Plastic Ball Grid Array Amkor Mechanical Samples Practical Dummy Components
		PBGA Plastic Ball Grid Array Amkor Mechanical Samples Practical Dummy Components
		Plastic Ball Grid Arrays (PBGA) incorporate advanced assembly processes and designs for low cost, high performance applications.
		MLF package is a near CSP plastic encapsulated package with a copper leadframe substrate.
	www.practicalcomponents.com /amkor/amkor-pbga.htm (255 words)

	Intel® Celeron® Processor - Integration Overview (FC-PGA2, FC-PGA and PPGA packages)
		The Intel Celeron processor is packaged in a Flip Chip Pin Grid Array (FC-PGA) or Plastic Pin Grid Array (PPGA) package which includes the processor core and the connection pins.
		Carefully install the processor into the 370-pin socket making sure that none of the pins are bent.
		Before removing the processor, consider removing the motherboard from the chassis.
	support.intel.com /support/processors/celeron/sb/CS-007435.htm (2578 words)

	9.3.1 BGA Component Rework, Eutectic Solder Ball (Site not responding. Last check: 2007-10-23)
		This procedure covers the most commonly used methods for replacing Plastic Ball Grid Array (PBGA) components and Ceramic Ball Grid Array (CBGA) components.
		These packages are typically referred to as Plastic Ball Grid Array (PBGA) or Tape Ball Grid Array (TBGA) or Chip Scale Package (CSP) components.
		A thorough review of the equipment manual and comprehensive training are mandatory.
	www.circuittechctr.com /guides/9-3-1.shtml (871 words)

	AP-577 An Introduction to Plastic Pin Grid Array (PPGA) Packaging
		As Intel microprocessors become faster, more complex and more powerful, the demand on high-performance packaging technology increases.
		The improvements in microprocessor speed and functionality drive the package design improvements in electrical, thermal and mechanical performance.
		This document describes the latest in microprocessors packaging technology, the Plastic Pin Grid Array (PPGA) Package.
	developer.intel.com /design/mobile/applnots/243103.htm (135 words)

	PPGA - Webopedia.com (Site not responding. Last check: 2007-10-23)
		PPGAs were first developed by Intel in 1993 to combat power supply decoupling issues in high-performance microprocessors.This square chip packaging technology was designed for microprocessors with greater numbers of transistors on each chip than previous models.
		An Introduction to Plastic Pin Grid Array Packaging
		Includes and overview, performance and system level characteristics and a performance comparison with CPGA.
	systems.webopedia.com /TERM/P/PPGA.html (172 words)

	Lead-free Assembly Defects in Plastic Ball Grid Array Packages (Site not responding. Last check: 2007-10-23)
		Printed circuit boards were assembled at Jabil¡¯s San Jose facility using their qualified surface mount assembly processes.
		The assembly involved lead-free plastic ball grid array (PBGA) packages (256 I/O) soldered to FR4 and polyamide printed circuit boards.
		The maximum peak lead-free reflow temperature measured at a PBGA location was 246
	www.calce.umd.edu /articles/abstracts/2005/grid.htm (227 words)

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