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Topic: Reflow soldering

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Wave soldering

	Reflow soldering device - Patent 6120585
		The reflow soldering device according to claim 1, further comprising means for maintaining a temperature of the outdoor air at a predetermined level prior to said flux removing means mixing the outdoor air with the exhaust gas.
		The reflow soldering device according to claim 7, further comprising a cooling device which cools the ambient air to a temperature that is lower than room temperature prior to said flux extractor mixing the ambient air with the exhaust gas.
		The reflow soldering device according to claim 7, further comprising a temperature controller for maintaining a temperature of the ambient air at a predetermined level prior to said flux extractor mixing the ambient air with the exhaust gas.
	www.freepatentsonline.com /6120585.html (3498 words)

	Reflow soldering - Wikipedia, the free encyclopedia
		Reflow soldering is the most common means to attach a surface mounted component to a circuit board, and typically consists of applying solder paste, positioning the devices, and reflowing the solder in a conveyorized oven.
		The goal of the reflow process is to melt the powder particles in the solder paste, wet the surfaces being joined together, and solidify the solder to create a strong metallurgical bond.
		The second section, thermal soak, is typically a 60 to 120 second exposure for removal of solder paste volatiles and activation of the fluxes, where the flux components begin oxide reduction on component leads and pads.
	en.wikipedia.org /wiki/Reflow_soldering (837 words)

	Reflow soldering: Facts and details from Encyclopedia Topic (Site not responding. Last check: 2007-10-20)
		Reflow soldering is the most common means to attach a surface mount[For more, click on this link]ed component to a circuit board[For more info, click on this link], EHandler: no quick summary.
		A solder is a fusible metal alloy (often of tin and lead), with a melting point or melting range below 450°c (840°f) and is melted to join metallic surfaces,...
		Wave soldering is a large-scale soldering process by which electronic components are soldered to a printed circuit board (pcb) to form an electronic assembly....
	www.absoluteastronomy.com /encyclopedia/r/re/reflow_soldering.htm (1097 words)

	World Intellectual Property Organization (Site not responding. Last check: 2007-10-20)
		After the solder paste is deposited on the circuit board, the circuit board is passed on a conveyor through a plurality of heating zones of a reflow soldering machine.
		Solder paste is routinely used in the assembly of circuit boards, where it is used to join electronic components to the board.
		Solder paste includes solder for joint formation and flux for preparing metal surfaces for solder attachment; the solder paste can be deposited on the circuit board by using a squeegee to force the solder paste through a metallic stencil laid over an exposed circuit board surface.
	www.wipo.int /ipdl/IPDL-CIMAGES/view/pct/getbykey5?KEY=03/90507.031030&ELEMENT_SET=DECL (4089 words)

	Infra-Red Reflow Soldering :: Radio-Electronics.Com
		Reflow soldering is the most widely used method of soldering for the manufacture or electronics printed circuit boards using surface mount technology.
		First a solder paste is applied to the board, and then secondly the board is heated to enable the solder to melt.
		The temperature rise rate that is often used for infra-red reflow soldering is between 2 and 3 C per second, although rise rates down to 1C per second may be used on some occasions.
	www.radio-electronics.com /info/manufacture/soldering/reflow_soldering/infrared_reflow_soldering.php (769 words)

	SMT in FOCUS - The Web Portal For Surface Mount Technology Engineers - Process Guide - Reflow Soldering (Site not responding. Last check: 2007-10-20)
		For the solder joint to perform a strong bonding between the solder pad and the component terminal, the cooling should be as fast as possible.
		Solder beading (side balls) are often a result of a combination of to much solder paste present at the pad, and outgassing of solvents overriding the solder paste cohesive force during the preheat phase.
		Solder cracks is often caused by wrongly designed solder pads (footprints), to much solder alloy at the solder spot or a later applied mechanical stress.
	www.smtinfocus.com /processguide_reflow.html (2868 words)

	Articles - Soldering (Site not responding. Last check: 2007-10-20)
		Soldering can be done in a number of ways, including passing parts over a bulk container of melted solder, using an infrared lamp, or by using a point source such as an electric soldering iron, a brazing torch, or a hot-air soldering tool.
		Soldering is distinct from welding in that the base materials to be joined are not melted, though the base metal is dissolved somewhat into the liquid solder much as a sugar cube into coffee - this dissolution process results in the soldered joint´s mechanical and electrical strengths.
		Due to the dissolution of the base metals into the solder, solder should never be reused; once the solder´s capacity to dissolve base metal has been achieved, the solder will not properly bond with the base metal and a cold solder joint with a hard and brittle crystalline appearance will usually be the result.
	www.sewing-center.com /articles/Soldering (1850 words)

	Spartanburg SC \| GoUpstate.com \| Spartanburg Herald-Journal (Site not responding. Last check: 2007-10-20)
		A solder is a fusible metal alloy, with a melting point or melting range below 450 Â°C (840 Â°F), which is melted to join metallic surfaces, especially in the fields of electronics and plumbing, in a process called soldering.
		Solder often comes pre-mixed with, or is used with, flux, a reducing agent designed to help remove impurities (specifically oxidised metals) from the points of contact to improve the electrical connection.
		Since solder can occasionally splash (due to the superheated flux inside or from contact with water in the cleaning sponge), it is recommended that safety goggles be worn when soldering.
	www.goupstate.com /apps/pbcs.dll/section?category=NEWS&template=wiki&text=solder (1235 words)

	Surface Mount Technology (SMT) - Soldering
		The purpose of flux in soldering is to remove oxidation from the surfaces to be soldered, i.e., component leads and PCB lands.
		Intrusive soldering (i.e., through-hole reflow, single-center reflow soldering, pin-in-paste, etc.) is a process in which both surface mount and through-hole components are soldered in a mass reflow soldering system.
		Vapor phase reflow: A process in which the PCB is sent through a sealed chamber of heated vaporized inert fluorocarbon that condenses on the joint, causing the solder to reflow.
	smt.pennnet.com /Articles/Article_Display.cfm?Section=Archives&Subsection=Display&ARTICLE_ID=80850&KEYWORD=Reflow (3065 words)

	[No title] (Site not responding. Last check: 2007-10-20)
		This high initial reflow temperature also tends to over-stress the components mounted on the printed circuit board 30, as they are commonly rated by component manufacturers to withstand only approximately 260 degrees C during soldering.
		Generally, the solder 46 is applied as a quantity of solder paste having a mesh size of-200+325, a metal content of 92%, and comprising a water soluble or RMA flux.
		or convection oven for reflow soldering of the components at a temperature of approximately 280 to 290 degrees C. This ensures that all of the solder (having a liquidus temperature of approximately 260 degrees C) is completely molten and the appropriate surfaces are wetted with the solder alloy.
	www.wipo.int /cgi-pct/guest/getbykey5?KEY=98/36626.980820&ELEMENT_SET=DECL (3196 words)

	nitrogen in reflow
		This prevents the solder pads and component terminals to oxidise during reflow of the solder paste.
		The nitrogen is used to drive out the oxygen from the soldering chamber and thereby prevent further oxidation of the solder land, solder paste particles and the component terminals.
		If there is no soldering failure registration available, it is necessary to collect these data for a period of minimum 3 month before adding the nitrogen to the soldering process.
	www.tkb-4u.com /articles/soldering/nitrogeninreflow/nitrogeninreflow.php (1522 words)

	Advanced Packaging - N<sub>2</sub> Inerting for Reflow of Lead-free Solders
		For lead-free solders, the volume ratio between the molten solder and the base metal is extremely sensitive to the degree of wetting and spreading, so the result obtained by using the wetting balance test may not accurately represent the performance for reflow.
		During reflow, misalignments can be corrected if the surface tensions of the molten solder and base metal to be soldered are sufficiently high, or the oxidations on both solder and base metal are minimized.
		To investigate the component's self-alignment ability in response to the reflow environment, a solder paste sample of 95.5 Sn/ 3.8 Ag/0.7 Cu with no-clean flux and a particle size range of 25-45 µm was printed on the trace area of a circuit board.
	ap.pennnet.com /Articles/Article_Display.cfm?Section=Articles&Subsection=Display&ARTICLE_ID=190554 (1764 words)

	Reflow soldering
		Reflow soldering by infra-red heating, often called infra-red soldering, is used mainly for the soldering of substrates with surface mounted components.
		The main difficulty with infra-red soldering of boards with surface mounted components is the different rate of heating of components of different thermal demand.
		After that, the soldering step with its rapid increase of temperature differentials has started, but at that moment the difference between the two temperature curves is still large, and hence the difference between the peak temperatures reached is also large.
	www.tutorialsweb.com /smt/chapter8.htm (585 words)

	FlipChips Dot Com Book Review, "Reflow Soldering Processes and Troubleshooting: SMT, BGA, CSP, and Flip Chip ...
		This excellent book on reflow soldering, by noted expert Doctor Ning-Cheng Lee, offers a unique approach that will be invaluable to anyone concerned with the practical applications of microelectronics packaging.
		The first four chapters are a clear and complete exposition of reflow soldering and of surface mount assembly processes.
		The logical structure is clear: three chapters on reflow problems, titled "Before Reflow," "During Reflow," and "After Reflow." Three chapters on the special techniques and the potential problems encountered in solder bumping area array packages, in assembling and reworking BGA and CSP packages, and in reflowing solder-bumped flip chips.
	www.flipchips.com /reviews/reviewlee.html (574 words)

	Surface mount reflow systems (Site not responding. Last check: 2007-10-20)
		Equipped as standard with adhesive application and soldering programmes which can be used as a basis for your own individual applications.
		When used with Nitrogen the system improves solderability of pcb's and assemblies by reducing oxidation and is widely tipped to be the best method of soldering with the new generation of lead free solders.
		The new generation of reflow soldering systems is extended with the addition of the "Pegasus".
	www.advanceproduction.sageweb.co.uk /surface.htm (515 words)

	Glossary - Reflow Soldering (December 2004) (Site not responding. Last check: 2007-10-20)
		It is necessary to heat and cool the assembly in a controlled manner and to maintain the solder joints in a liquid state long enough to eliminate voiding and form a true intermetallic bond with the base materials.
		Reflow soldering first was known in the hybrid soldering for ceramic substrates.
		Typically reflow for tin/lead in convection will be between 210-225ºC. For VPS it will be 215ºC. In a convection oven a board assembly is transported on a mesh belt or supported on parallel pin conveyors through an oven featuring a number of zones.
	www.emtonthenet.net /glossary/reflowsoldering.html (313 words)

	Method and apparatus for reflow soldering of electrical component leads, including floating heater bar - Patent 4894506
		A method of reflow soldering a row of electrical component leads to a printed circuit board using a heater bar is disclosed.
		To accomplish this, it is known to position the component on the board and then apply heat to solder the leads, the heat being applied by a heater bar which solders all of the leads along one side of the component simultaneously.
		It is an object of the invention to provide an improved method of reflow soldering rows of electrical component leads to a printed circuit board using a heater bar, and to provide apparatus for carrying out the method.
	www.freepatentsonline.com /4894506.html (2299 words)

	Reflow Soldering (Site not responding. Last check: 2007-10-20)
		After the application of solder paste and component placement, fused solder joints are formed by exposing the assembly to thermal energy, in order to heat the solder paste and its local environment above the melting point of the alloy.
		Reflow ovens, used in the electronics assembly industry; derive most of their primary heat from electrically-powered sources that radiate heat energy.
		Often referred to as IR reflow, this is something of a misnomer, and should more properly be referred to as radiant reflow.
	www.sonitron.be /index.cfm?PageID=2668 (680 words)

	Surface Mount Technology (SMT) - Hybrid Reflow Profiles
		When a lead-free BGA is reflow soldered with SnPb solder paste and a standard SnPb reflow profile, the lead-free solder balls on the BGA may not melt completely.
		During reflow soldering, the Pb diffuses through the grain boundaries in the lead-free BGA solder ball.
		This situation produces solder joints with Pb-rich grain boundaries and a solder joint microstructure that is not homogeneous.
	smt.pennnet.com /Articles/Article_Display.cfm?Section=Articles&Subsection=Display&ARTICLE_ID=234561 (836 words)

	Reflow Soldering Processes and Troubleshooting: SMT, BGA, CSP and Flip Chip Technologies \|... (Site not responding. Last check: 2007-10-20)
		Written using a very practical, hands-on approach, Reflow Soldering Processes and Troubleshooting provides the means for engineers to increase their understanding of the principles of soldering, flux, and solder paste technology.
		This excellent book on reflow soldering, by noted expert Doctor Ning-Cheng Lee, offers a unique approach that will be invaluable to anyone concerned with practical applications of microelectronics packaging.
		The logical structure is clear: three chapters on reflow problems, titled "Before Reflow," "During Reflow," and "After Reflow." Three chapters on the special techniques and the potential problems encountered in solder bumping area array packages, in assembling and reworking BGA & CSP packages, and in reflowing solder-bumped flip chips.
	www.this-is-great.com /info/frnfjrsell (1047 words)

	AIR LIQUIDE / Electronics / Nitrogen Reflow Soldering-Soldering with inert gas (Site not responding. Last check: 2007-10-20)
		Reflow soldering is the main soldering method to connect surface mount devices (SMDs), Multi-Chip modules and hybrid components to circuit boards.
		Use of nitrogen for inert soldering in the assembly of PCBs continues to increase worldwide in both wave and reflow soldering operations.
		More and more, assemblers are recognizing the value of inert soldering in improving joint quality and yield while reducing sensitivity to process variables and fluctuations ('process window widening').
	www.us.airliquide.com /en/business/industry/electronics/applications/reflow_soldering.asp (514 words)

	Thermal Profiling in Reflow Soldering -- ECD
		Solder Paste - sometimes referred to as "a mysterious gray sludge." Solder paste is made up of small solder balls and flux.
		Solder paste manufactures typically have profile recommendations specific to their paste formulations.
		The first step in the profile is a preheat period that brings the assembly from room temperature to a preheat temperature and evaporates the solvents from the solder paste.
	www.ecd.com /emfg/instruments/tech2.asp (1063 words)

	ERSA \| Products \| Reflow Soldering \| Leadfree Soldering
		In the reflow as well as in the wave- and selective soldering processes, solder joints must be produced under exactly determined conditions to guarantee reliable connections.
		Lacking this reliability and repeatability characteristics, soldering defects may occur which are difficult to detect during a visual inspection procedure or in a functional test.
		Considering this narrow temperature range it becomes immediately obvious how small the process window for lead-free reflow soldering really is. Artificially increasing the process window by raising the peak temperature in the reflow zone to 260°C (500°F) should be scrutinized closely, as this may damage components.
	www.ersa.de /en/produkte/reflowsysteme/bleifrei-loeten.html (725 words)

	Reflow soldering
		Solder reflow starts happening when the paste is taken to a temperature above the melting point of the solder, but this temperature must be exceeded by approximately 20°C to ensure quality reflow.
		Vapour phase soldering lost much of its popularity in the early 1990s due to its high running costs, uncertainty about achievable assembly yields, and environmental concerns; relaunched as condensation soldering in the late 1990s, the process is gaining ground, especially with the advent of lead-free solders.
		One of the strategies normally considered is the use of an inert soldering atmosphere, to reduce oxidation and the demands made of the flux, and to increase the process window.
	www.ami.ac.uk /courses/topics/0132_rs (4949 words)

	Spark Fun Electronics (Site not responding. Last check: 2007-10-20)
		Soldering from the back side of the PCB using vias as heat ducts has worked for other people.
		Time and time again, either the USB connector would fail to reflow because of the metal housing reflecting the heat, or we would bake the board so long that the USB would reflow but the plastic Camera connector would be completely hosed.
		The USB connector was soldered solidly to the board and all plastic parts survived.
	www.sparkfun.com /tutorial/ReflowToaster/reflow-hotplate.htm (1614 words)

	Thermal Imaging Certifies Reflow Soldering Process - Test & Measurement World (Site not responding. Last check: 2007-10-20)
		Soldering PCBs in a reflow oven is the most commonly used assembly method in the electronics industry today.
		Their requirement is for verification that the reflow process subjects none of the PCBs in assembly to excessive temperatures during soldering.
		The temperature of the soldering paste on a PCB follows a typical profile as it passes the four zones of a reflow soldering oven.
	www.reed-electronics.com /tmworld/article/CA187583 (1104 words)

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