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| | Semiconductor Equipment Corporation, Assembly, Rework, Handling and Test Equipment |
 | | S.E.C. is the distributor for the US, Canada, and Mexico. |
 | | The new i-Cube II will compliment SEC’s current line of manual and semi-automatic die bonders, flipchip placement and bonding systems, laser diode bonders, eutectic die bonders, pick-and-place systems, tape applicators, die ejectors, rework stations, wafer dicing tape, UV curable and high purity tapes, and multifunctional bond testers. |
 | | The i-CUBE II is a high-speed, automatic die bonder capable of mixed mounting SMD components and semiconductor components as well as handling multiple types of components. |
| www.semicorp.com (453 words) |
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