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	Sputtering Technology
		During sputtering, energized plasma ions strike a "target", composed of the desired coating material, and cause atoms from that target to be ejected with enough energy to travel to, and bond with, the substrate.
		The process of "sputtering" has come a long way since it was first used to silver the backs of mirrors in the late 19th century.
		As a result, early use of metal sputtering gave way for a time to vacuum evaporation, which employs resistive or e-beam heating, because its deposition rates were higher.
	www.angstromsciences.com /technology/sputtering-technology/index.html (571 words)

	Sputtering Materials, Inc.
		Sputtering Materials, Inc. (SMI) has a proven track record of over 25 years of success and first-class customer service.
		Our 20k square-foot facility is equipped with an in-house C-Scan, a research and development lab, a machine shop for Silicon and backplates, sputtering systems, and more.
		Please download the Request for Quotation form, fill it out and fax it to Sputtering Materials, Inc. at (775)787-2663.
	www.sputteringmaterials.com (289 words)

	Sputtering Information
		Sputtering is a physical process whereby atoms in a solid target material are ejected into the gas phase due to bombardment of the material by energetic ions.
		A typical ring-geometry sputter target, here gold showing the cathode made of the material to be deposited, the anode counter-electrode and an outer ring meant to prevent sputtering of the hearth that holds the target.
		Sputtering sources are usually magnetrons that utilize strong electric and magnetic fields to trap electrons close to the surface of the magnetron, which is known as the target.
	www.bookrags.com /wiki/Sputtering (1371 words)

	Sputtering apparatus - Patent 5026470
		The substrate upon which the magnetic thin film is to be deposited is mounted within the vacuum chamber, and a permanent magnet plate is mounted parallel to the substrate surface to improve the uniformity of the magnetic field at the substrate surface.
		It is therefore the principal object of this invention to provide a sputtering apparatus in which a polygon-shaped planar electromagnetic coil is adjacent to the surface of the substrate for maintaining the orientation of deposited thin magnetic films during relative motion between the target and the substrate.
		The sputtering apparatus 10 of the invention comprises a vacuum enclosure 12 and a vacuum pump (not shown) to evacuate the sputtering enclosure to a desired background pressure level.
	www.freepatentsonline.com /5026470.html (1699 words)

	Deposition rate regulation by computer control of sputtering systems - Patent 4166783
		It is known, however, that certain components of sputter coating apparatus are subject to deterioration; for example, the target (cathode), which is the source of sputterant, erodes under ion bombardment in such fashion as to significantly alter the geometry of the cathode surfaces during the useful life thereof.
		In yet another feature of the invention the operating parameters of the excitation source for said sputtering apparatus is controlled by said computer in response to the monitored power dissipated, the cumulative history of the sputtering cathode the pressure within the sputtering chamber and the desired rate of deposition.
		A sputtering apparatus 2 comprises an anode 5 and cathode structure 7 with auxiliary structures 9.
	www.freepatentsonline.com /4166783.html (2076 words)

	TESTBOURNE LTD - Sputtering Targets
		Sputtering is a proven technology capable of depositing thin films from a wide variety of materials on to diverse substrate shapes and sizes.
		The process is repeatable and can be scaled up from small research and development projects, to production batches involving medium to large substrate areas.
		Most sputtering target materials can be fabricated into a wide range of shapes and sizes.
	www.testbourne.com /pages/sputteringtargets/sputteringtargets.htm (159 words)

	Vacuum, Sputtering, Evaporation & Etching Semiconductor Equipment: New & Used
		Vacuum, Sputtering, Evaporation & Etching Semiconductor Equipment: New & Used
		Our high-performance production or RandD vacuum sputtering and thin-film evaporation systems provide coatings on a variety of materials including plastic films, glass, ceramics, metals and hybrid substrates.
		This series is based on the popular MRC 603, 643, 903 and 943 sputtering units.
	www.semicore.com (271 words)

	Metallic & Non-Metallic Sputtering Materials - Williams Advanced Materials
		Williams specializes in a wide variety of base metals, vacuum cast and powder consolidated alloys, cermets and ceramics.
		Williams is the only sputtering target manufacturer to fully embrace both vacuum casting and powder metallurgy technologies for metallic and non-metallic sputtering materials.
		Metallic and non-metallic sputtering materials are produced in a wide array of shapes and sizes meeting the requirements of virtually any machine design.
	www.williams-adv.com /thinFilm/sputtering-materials.php (215 words)

	Sputtering
		Cleaning is especially required after a nonmetal sputtering to avoid accumulation of charges (all the surrounding must be well grounded).
		Before sputtering, it is a good practice to use the ohmmeter to test the resistance between the target and the dark space shield as well as between the target and the base of the vacuum system to make sure that there is no shorting (dark space shield and the base must be grounded).
		During this sputtering process, one may have to continue checking the reflected power and may have to do small adjustment again.
	www.fisk.edu /~aburger/Published03_06/Instruments/Sputtering_/sputtering_.html (1038 words)

	Sputtering - What is Sputtering? AJA International, Inc.
		A sputtering system configuration where multiple magnetron sputtering sources are arranged in a specific circular pattern and are aimed at a common focal point.
		The con-focal sputtering configuration is compact and maintains the substrate holder in an axial orientation.
		A sputtering system configuration where the substrate is positioned or moving directly in front of and parallel to the magnetron sputtering source targets.
	www.ajaint.com /whatis.htm (1516 words)

	CERAC, inc.: Product Overview: Sputtering Targets
		CERAC sputtering targets can be manufactured from virtually any physically feasible composition and are available in all popular geometries including circular, planar, rectangular and conical.
		CERAC sputtering targets are manufactured from a wide variety of compositions in various purity levels, allowing our customers to match targets to their specific requirements.
		CERAC sputtering targets are produced in many standard shapes and sizes including rings, S-Guns and circular, rectangular and triangular planar targets.
	www.cerac.com /products/sputteri.htm (394 words)

	Sputtering Parameters of Optical Materials (Site not responding. Last check: 2007-10-26)
		Besides the most of theories of sputtering describe a process in the approximation of monatomic target, but even for monoatomic targets a difference between theoretical and experimental values of sputtering yield (rate) may be big enough (2 - 3 times).
		I sputtered in the same time a few target surfaces, one of which was normal to the incident ion flux, and others were located at different angles to the ion flux (Fig.1, patented).
		The sputtered depth was measured using micro interferometer by the shift of interference stripes on the step between masked and unmasked areas of sputtered surface.
	home.earthlink.net /~chutko/sputter.htm (1376 words)

	Sputtering Electrodes (Site not responding. Last check: 2007-10-26)
		The sputtering electrodes can be readily converted between modes by simply adding or removing the magnetic elements.
		The sputtering electrodes are of a circular planar design enabling low cost flat disks of material to be used as targets.
		Alternatively, the target material can be directly bonded to the sputtering electrode where high power levels are used and in production applications.
	www.cpa-sputtering.com /N2550c.htm (927 words)

	Process and apparatus for the manufacture of a sputtering target patent invention (Site not responding. Last check: 2007-10-26)
		[0005] Sputtering targets have traditionally been manufactured through the use of different powder metallurgical techniques for the formation of the target plate made of high purity materials, which are subsequently mounted on the target backing material for proper heat management under its final operating conditions.
		[0008] According to a first aspect of the present invention, there is provided a process for the manufacturing of sputtering targets through the plasma deposition of the target material directly on the target support, or on a temporary substrate, from which the deposit is latter transferred to the final baking of the target material.
		[0016] a plasma torch for melting of a material selected to form the sputtering target, yielding droplets of molten material and for deposition of these droplets onto a coating-receiving surface of a substrate, yielding a sputtering target comprised of a coated layer of the material on the coating-receiving surface of said substrate.
	www.freshpatents.com /Process-and-apparatus-for-the-manufacture-of-a-sputtering-target-dt20061019ptan20060233965.php (946 words)

	CPFilms - Sputtering
		In sputtering, positive ions from gaseous plasma bombard the material that is to be deposited on the substrate, physically ejecting particles from the surface of the target material.
		Among the many applications using sputter coating technology from CPFilms are flexible printed circuits, membrane switches, digital proofing, reprographics, decorative automotive badges, and solar control window films.
		Sputter coating is available on film thicknesses ranging from 0.5 mil to 20 mils (12 to 500 microns), in roll dimension widths from 12 to 80 inches (30.5 cm to 203 cm).
	www.cpfindusprod.com /4.3.asp (286 words)

	TESTBOURNE LTD - Sputtering Targets
		Sputtering is a proven technology capable of depositing thin films from a wide variety of materials on to diverse substrate shapes and sizes.
		The process is repeatable and can be scaled up from small research and development projects, to production batches involving medium to large substrate areas.
		Most sputtering target materials can be fabricated into a wide range of shapes and sizes.
	www.testbourne.co.uk /pages/sputteringtargets/sputteringtargets.htm (159 words)

	Sputtering Materials and Equipment from Equipment Support Company USA
		Sputtering Materials and Equipment from Equipment Support Company USA
		High Purity Sputtering Targets are manufactured in all popular geometries including planar, circular, rectangular, ring, delta, conical, and custom configurations.
		These materials are either vacuum melted, e-beam melted, hot pressed, or sintered.
	www.equipmentsupportcompany.com /mat_sputtering.shtml (206 words)

	Sputtering Targets - Honeywell Electronic Materials
		Honeywell Electronic Materials is the world’s largest manufacturer of sputtering targets for the semiconductor industry.
		To remain competitive in an industry driven by high yields and lower cost of ownership, manufacturers must depend on their suppliers to provide materials of the highest quality.
		Our technical support team is comprised of sputtering engineers from the semiconductor industry with experience on all major types of sputtering equipment.
	www.honeywell.com /sites/sm/em/metalsn3_cat19af7e5-f9c56013eb-e0df9bfada07602278603c6cb43673fb_HTM19af7e5-f9c567abdc-e0df9bfada07602278603c6cb43673fb.htm (190 words)

	Deposition Materials and Sputtering Targets for Semiconductor Processing Information \| Business.com
		Manufacturer of several compositions of sputter targets for a range of applications such as optical, dielectric and wear.
		Supplier of sapphire and ruby components, precision ceramics and adhesives, rare earth oxides and powders, sputtering targets and superconductor powders, single crystal substrates, and spin and dip coating machines and more.
		Manufacturer of sputtering targets and evaporation materials dedicated to serving the PVD industry.
	rd.business.com /index.asp?epm=s.1&bdcq=Sputtering&bdcr=2&bdcu=http://www.business.com/directory/electronics_and_semiconductors/semiconductors/materials_and_wafers/deposition_material_and_targets/index.asp?partner=2662601&bdcp=&partner=2662601&bdcs=nwuuid-2662601-308CC00E-C8B8-512A-5A0E-9555EBED40C2-ym (387 words)

	MRS Website : Interdiffusion of Ni80Fe20/Mo magnetic multilayers prepared by magnetron sputtering (Site not responding. Last check: 2007-10-26)
		The multilayers have been fabricated by using a magnetron sputtering system.
		The decay with annealing time in the intensity of the first-order x-ray satellite peak arising from the composition modulation was used to determine the effective interdiffusion coefficient D
		The much lower activation enthalpy is attributed to the coherence strains existing in the multilayers.
	www.mrs.org /s_mrs/sec_subscribe.asp?CID=2295&DID=79905&action=detail&css=print&css=print&css=print&css=print&css=print&css=print&css=print&css=print&css=print&css=print&css=print&css=print&css=print&css=print&css=print&css=print&css=print&css=print&css=print (218 words)

	Loss of atmosphere from Mars due to solar wind-induced sputtering -- Kass and Yung 268 (5211): 697 -- Science
		Loss of atmosphere from Mars due to solar wind-induced sputtering
		Because Mars does not have a strong intrinsic magnetic field, the atmosphere is eroded by interactions with the solar wind.
		It is calculated that approximately 3 bars of carbon dioxide (CO2) have been sputtered over the last 3.5 billion years.
	www.sciencemag.org /cgi/content/short/268/5211/697 (333 words)

	MRS Website : Microstructure and Electrical Properties of Zinc Oxide Thin Film Varistors Prepared by RF Sputtering (Site not responding. Last check: 2007-10-26)
		The thin film varistors of ZnO-Bi2O3 multilayer junctions were fabricated by RF sputtering.
		The nonlinear I-V characteristics and nonlinear coefficient, á, under reverse bias were found to be effected by the composition and structure of the varistor multilayers.
		The threshold voltage is predominantly determined by the microstructure and thickness of the Bi2O3 layer in thin film varistors, while that can be tuned by altering the donor density in ZnO, which was achieved by varying Al doping concentration or sputtering conditions.
	www.mrs.org /s_mrs/sec_subscribe.asp?CID=2620&DID=116193&action=detail&css=print&css=print&css=print&css=print&css=print&css=print&css=print&css=print&css=print (199 words)

	CHA Industries Evaporation and sputtering system for semiconductor, optical and precision coating applications
		CHA Industries Evaporation and sputtering system for semiconductor, optical and precision coating applications
		CHA Industries is a leading design and manufacturer of Vacuum Sputtering and Deposition equipment.
		Our fully integrated manufacturing facility has provided insightful and innovative systems for both Research and High Production requirements both domestically and internationally for over 50 years.
	www.chaindustries.com (107 words)

	Sputtering when taking off... - MSD Ignition Tech Support Forums
		He has brought it in for a sputtering problem on take off.
		He no longer has the instructions on the installment procedure and I would like to know if there is a place that I can go to find the wiring diagrams for installation and if you have any suggestions regarding the sputtering problem.
		Here is the link to where you can check the wiring to the Dodge application.
	www.msdignition.com /forum/showthread.php?t=432 (134 words)

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