| |
| | Reactive, thixotropic hot-melt adhesive on silane basis - US Patent 4871590 (Site not responding. Last check: 2007-10-29) |
 | | Traditionally, hot-melt adhesives (hot melts) are thermoplastic materials, which are heated for their processing in a dispensing gun or in another device to a temperature of 90°-200° C. and are applied as a liquid mass to the substrates to be bonded. |
 | | The thixotropic agent according to the present invention is selected from the group consisting of bentonite, carbon fl, silicic acid derivatives, precipitated chalks, polyvinylchloride, urea derivatives and acrylate derivatives. |
 | | The inventive thixotropic, hot-melt adhesive having reactive silane groups, may be used for bonding and/or sealing one or more materials of the same or different origin to a composite. |
| www.patentstorm.us /patents/4871590.html (4499 words) |
|