| | Tailorable multi-layer printed wiring boards of controlled coefficient of thermal expansion - Patent 4876120 |
 | | The negative coefficient of thermal expansion and high modulus of elasticity of the liquid crystal polymers enable a laminate and MLPWB to be manufactured therefrom having a tailored coefficient of thermal expansion, broadly ranging from about 0 to 15 ppm/.degree. |
 | | In the construction of a multi-layer printed wiring board (MLPWB), a method for controlling the in-plane linear coefficient of thermal expansion (CTE) thereof which comprises forming at least one layer of said MLPWB from a liquid crystal polymer selected from the group consisting of poly(para-phenylene benzobisthiazole), poly(para-phenylene benzobisoxazole), poly(2,5-benzothiazole), poly(2,5-benzoxazole), and mixtures thereof. |
 | | The negative coefficient of thermal expansion and high Young's modulus of the preferred liquid crystal polymers enable a laminate and MLPWBs manufactured therefrom to have a precisely controlled coefficient of thermal expansion, for example, broadly ranging from about 0 to 15 ppm/.degree.C. and advantageously 3 to 7 ppm/.degree.C.. |
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