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Topic: Wafer (electronics)

	Wafer (electronics)
		In microelectronics, a wafer is a thin slice of semiconducting material, such as a silicon crystal, upon which microcircuits are constructed by doping (for example, diffusion or ion implantation), etching, and deposition of various materials.
		Wafers are thus of key importance in the fabrication of semiconductor devices such as integrated circuits.
		Scoring the wafer along cleavage planes allows it to be easily diced into individual chips ("dies") so that the billions of individual circuit elements on an average wafer can be separated into many individual circuits.
	www.reboom.com /article/Wafer_(electronics).html (241 words)

	Silicon Wafer - Silicon Wafers - Silicon Wafer Manufacturer - Silicon Wafer Manufacturing - Semiconductor Wafer - ...
		Silicon Valley Microelectronics, Inc. (SVM) is in its 15th year as a leading distributor of silicon wafers and provider of silicon wafer services for the semiconductor industry.
		SVM supplies silicon wafers custom made to your requirement in a variety of diameters and grades.
		In addition to same-day delivery, SVM provides a silicon wafer stocking program with cost savings providing you with on time deliveries of high quality silicon wafers only as needed.
	www.svmi.com (392 words)

	Aligned Wafer Bonding for 3-D Interconnect - Semiconductor International (Site not responding. Last check: 2007-10-25)
		Aligned wafer bonding is a wafer-to-wafer 3-D interconnect technology where the wafers are aligned and bonded face to face or back to face, and then thinned and interconnected prior to additional stacking processes or dicing (Fig.
		Wafer bonding and wafer-to-wafer alignment are well established technologies from MEMS manufacturing, but they require process and equipment enhanced to provide the compatibility with back-end CMOS IC wafer processing, as well as micron-size through-die interconnectivity needed in 3-D ICs.
		The top wafer in the two-wafer stack is thinned to ~1 µm by backside grinding, chemical mechanical polishing (CMP) and selective wet etching to an etch stop (e.g., an implanted layer, a graded SiGe epitaxial layer, or a buried oxide [BOX] layer with SOI wafers).
	www.reed-electronics.com /semiconductor/article/CA630263?nid=2301 (2650 words)

	Wafer Scale Emerging - 1/22/2001 - Electronic News
		The principal difference between a wafer CSP and a flip-chip die (according to Prismark's definition) is that a wafer CSP is post processed after the fab with larger bump pitches, whereas a flip-chip die will be completed in the fab.
		This current wafer CSP pitch limitation of 0.5mm means that wafer CSPs tend to be limited to low leadcount devices (less than 30 I/O) or larger area die with medium leadcounts (memory).
		Wafer CSP technology is particularly suited to low leadcount devices of less than 30 I/O. These include microcontrollers, temperature sensors, A to D converters, regulators, op amps, reference die, small digital signal processors, and very small memory devices.
	www.edn.com /article/CA61524.html?partner=enews (1369 words)

	Semiconductor production for sale and wafer disk
		Manufacturing systems for the semi conductor industry, according to the CVD technology (chemical vapor deposition), which is a process that creates layers of materials (insulating, conductor or semiconductor) on the surface of the silicon wafers, by means of a controlled chemical reaction.
		This technology combines chemical processes and heating in vacuum conditions, intended for manufacturing processes in which each silicon wafer is manufactured separately (single wafer processing).
		Quantitative serial manufacturing characterized by a high percentage of disqualification, instead of manufacturing a single wafer in a combined and qualitative process with a high efficiency percentage.
	www.dfarber.com /Technology_Details.htm (352 words)

	SOI Wafer Demand To Continue To Increase In The Coming Years
		Many chips are made on a single wafer, then separated into dice (plural of die) and packaged individually.'); return false">Chip designers and manufacturers have constantly pushed the envelope of technological, physical, and design constraints.
		Thin-film SOI wafers (silicon film thickness of less than 1-micron) are manufactured with several different types of manufacturing technologies, all of which are patented.
		As the industry moves towards the era of the 300-mm wafer generation, cost reduction per chip will progress significantly to allow SOI device applications to expand from the midrange to the low-end segment.
	www.electronics.ca /presscenter/articles/8/1/SOI-Wafer-Demand-To-Continue-To-Increase-In-The-Coming-Years/Page1.html (1035 words)

	MICRO: Implementing a single-wafer cleaning technology
		Following the last dilute-HF treatment, either DI water is applied to the wafer to obtain a hydrophobic silicon surface or ozonated water is applied to obtain a hydrophilic silicon surface.
		While most of the iron and aluminum atoms on the wafer surface are ionized and dissolved into the ozonated water, some iron and aluminum atoms remain in the chemical oxide grown during the ozonated-water treatment because these atoms have a higher oxide generation enthalpy than silicon.
		However, the copper contaminants are covered with a chemical oxide grown during the prolonged presence of ozonated water on the wafer surface, and that chemical oxide obstructs the dissolution of the copper atoms by the ozonated water.
	www.micromagazine.com /archive/03/01/hattori.html (3067 words)

	Semiconductor Automation Equipment – Robotic Wafer Handling Systems, Wafer Transfer Robots, Thin ( Gallium Arsenide ...
		This WaferFlex version used a non-contact Bernoulli End Effecter to pickup ultra thin wafers from a cassette, transfer wafers to a vision inspection stage, inspect the wafers for surface defects, mark bad dies with ink, cure the ink with UV light, then transfer the wafers to a packing station and pack the wafers for shipment.
		Wafer Vision Inspection and Marking: Systems perform wafer inspection to detect scratches, bad dies and other defects.
		Wafer Types: Various types of wafers are handled including thin and ultra-thin wafers, photovoltaic solar cells (photocells), silicon (si) wafers, gallium arsenide (GaAs) wafers and other wafer materials, 150 mm, 200 mm, 300 mm wafers, hard disks (disk drive and disk drive components).
	www.ssirobotics.com /Wafer_Handling.html (988 words)

	Silicon Wafer Shipments Increase in Third Quarter 2006
		Total silicon wafer area shipments were 2,074 million square inches during the most recent quarter, an increase from the 1,966 million square inches shipped during the previous quarter.
		Silicon wafers are the fundamental building material for semiconductors, which in turn, are vital components of virtually all electronics goods, including computers, telecommunications products, and consumer electronics.
		The highly engineered thin round disks are produced in various diameters (from one inch to 12 inches) and serve as the substrate material on which most semiconductor devices or "chips" are fabricated.
	www.electronics.ca /presscenter/articles/450/1/Silicon-Wafer-Shipments-Increase-in-Third-Quarter-2006/Page1.html (413 words)

	wafer offers from China wafer wholesale,wafer manufactures,wafer distributors
		Connecting China wafer exporters with global wafer importers, ECVV trends to be your best business choice in the wafer industry.
		Jiangsu Changjiang Electronics Technology CO.,Ltd is specialized in IC packaging and Dynatron manufacture In China.
		Please note we are a famous company in the electronics assembly, packaging, test and have many advantages of electronics packaging: top-rank staff, eq...
	www.ecvv.com /tradeleads/P1T0V1IY0CZ0K/Wafer.html (395 words)

	[No title]
		Spread 1 teaspoon caramel topping in center of each wafer to within about 1/4 inch of edge.
		Add chocolate wafer crumbs; cover and pulse on HIGH speed until mixed.
		Silicon Wafers - Silicon Wafer - Silicon Reclaim - GaAs Wafers...
	www.howstuffworks.com /search2.php?pg=&server=www.howstuffworks.com&terms=wafer (544 words)

	wafer \| English \| Dictionary & Translation by Babylon
		Note: Millions of individual circuit elements, constituting hundreds of microcircuits, may be constructed on a single wafer.
		The individual microcircuits are separated by scoring and breaking the wafer into individual chips ("dice").
		Wafers are a few millimeters thick and are available in a variety of diameters with 100 millimeter, 125 millimeter, 150 millimeter and 200 millimeter being the most common and 300 millimeter just entering use.
	www.babylon.com /definition/wafer/English (249 words)

	FlipChip International :: FlipChip International and NEC Electronics Sign Cross-Licensing Agreement for Advanced Wafer ...
		Wafer level packaging, a process whereby semiconductors are packaged on the wafer prior to dicing, offers significant advantages in form factor and weight that enable real chip-scale packaging (CSP).
		Commenting on the agreement, Bob Forcier, President and CEO of FlipChip International, said, "We are very pleased to commence a cross licensing agreement with NEC Electronics for next generation flip chip and wafer level packaging, which provide substantial improvements in performance, lower costs and dramatic reductions in size compared to traditional packaging technologies.
		NEC Electronics Corporation specializes in semiconductor products encompassing advanced technology solutions for the high-end computing and broadband networking markets, system solutions for the mobile handset, PC peripherals, automotive and digital consumer markets, and platform solutions for a wide range of customer applications.
	sev.prnewswire.com /computer-electronics/20050421/LAW08520042005-1.html (503 words)

	SAMSUNG's Digital World - Press Release
		This is yet another first for Samsung Electronics, which was also the first company in the memory industry to begin mass-producing 200mm wafers back in 1993.
		Samsung Electronics maintained a dominating 60%+ share of the Rambus DRAM market in 2001, and the company currently turns out the equivalent of ten million 128 Mb DDR chips each month to retain the largest share of that market as well.
		Samsung Electronics plans to retain its lead in processing technology, applying the 0.10-micron design rule next year and mass-producing chips with 0.07-micron circuitry by 2004.
	www.samsung.com /au/presscenter/pressrelease/global_pressrelease.asp?seq=20011030_0000000628 (1355 words)

	Electronics: silicon-wafer-in-dish- - Si, semiconductor
		Note that other semiconductors such as Germanium (Ge) and Gallium Arsenide (GaAs) can be used to make devices with different characteristics cf silicon equivalents such as higher speed in return for higher leakage.
		silicon wafer = Often-circular slice of very pure Silicon on which multiple devices are fabricated, and from which individual "silicon chips" or "microchips" are cut to be packaged up if they pass testing.
		Electronic components and circuitry, a long-time interest/hobby/job for DHD...
	gallery.hd.org /_c/electronics/silicon-wafer-in-dish-DHD.jpg.html?sessionVar=spider&sessionVarLiteUI=true (228 words)

	Honeywell Solid State Electronics Center
		Honeywell Achieves Department of Defense Accreditation of Trust as a Silicon Wafer Foundry
		Offers Radiation Hardened Electronics which includes ICs for electronic computer systems in military satellites...
		Includes electronic components and multi-chip modules for instrumentation and control applications...
	www.ssec.honeywell.com (126 words)

	Cookson Electronics: Enthone
		Formulated to plate at high deposition rates while maintaining very tight bump height uniformity both “within the die” as well as “within the wafer,” the process provides a lead-free alternative to eutectic tin-lead bumping when plated at the ratio of 97.5Sn/2.5Ag.
		High-build bumps may be produced on fine semiconductor wafers for superior bump and circuit line performance.
		Specially designed for rack and barrel plating systems, the process may be used for a diversity of applications, including electronic housings and connectors.
	www.enthone.com /microelectronics/index.aspx (3048 words)

	Dalsa Develops 111-Megapixel CCD - Gizmodo
		The cost of the wafer itself is more or less fixed.
		Which is why full-frame digital cameras will take a long time to come down in price (though their megapixels will continue to grow) - the sensor price is fixed due to the size of the silicon wafer.
		Electronics get cheaper because they take less space on a wafer (so you can make more chips per wafer), and processes improve so yield improves (producing more viable chips per wafer).
	gizmodo.com /gadgets/digital-cameras/dalsa-develops-111megapixel-ccd-182015.php (423 words)

	Advanced Packaging - 2006: Bring It On (Site not responding. Last check: 2007-10-25)
		The semiconductor industry is moving to single-wafer processing for increased throughput in its wafer plating and bumping processes.
		The electronics industry is dynamic and volatile, leading to the boom and bust cycles that we have seen in recent years.
		Our challenge is to position ourselves to deliver electronics design automation software that allows our customers to address emerging technology challenges within a global enterprise.
	ap.pennnet.com /articles/article_display.cfm?article_id=245397 (3383 words)

	VSEA - Products - Single Wafer
		First, we know the yield loss caused by ballistic particles inherent in batch tools are a major driver for the transition from batch to single wafer.
		Recently, however, chipmakers are also finding that additional particles are contaminating the wafer during the ion implantation process on single magnet tools which is causing a major yield loss.
		Moore’s Law states that the number of transistors per square inch in an integrated circuit will double every 18 months, and in the near future, implant is seen to be the focus area device designers will use to stay on the performance improvement curve.
	www.vsea.com /products/SingleWafer (423 words)

	Amazon.com: 250A GOLD PLATED WAFER FUSE: Electronics (Site not responding. Last check: 2007-10-25)
		This item is not eligible for Amazon Prime, but over a million other items are.
		Buy this item with WAFER FUSE HOLDER by Parts Express today!
		Amazon Grocery is heating up with smokin' summer deals on cold drinks, barbecue sauces, and more.
	www.amazon.com /250A-GOLD-PLATED-WAFER-FUSE/dp/B0002KR47A (356 words)

	Overview \| Wafer Foundry \| NEC Electronics America - Semiconductor Solutions
		One of the most important benefits of working with the NEC Electronics America foundry in Roseville is the unprecedented access you'll have to our team of experienced production engineers, as well as our design engineers in Santa Clara, California.
		Working with NEC Electronics America helps you avoid the constraints that may have made manufacturing your chips difficult in the past.
		To find out how NEC Electronics America can get your chips into production right away, please call 800-366-9782 or email us at necfoundry@am.necel.com.
	www.am.necel.com /foundry (268 words)

	Hitachi High Technologies America : Sapphire Wafer
		Our Sapphire wafers are generated using the latest technology to maximize quality and transmittance.
		Properties depend on crystallographic direction (relative to the optical C-axis).Sapphire wafer is a single crystal (Al)Sapphire single crystal is highly trusted material with its excellent chemical stability, mechanical property, and light transmission.
		The Sapphire single crystal and wafer are utilized for various electronic and optical parts.
	www.hitachi-hta.com /pageloader~type~product~id~242~orgID~39~subpage~270.html (131 words)

	90nm is Factory-Bound - 2/11/2004 - Electronics Weekly (Site not responding. Last check: 2007-10-25)
		TI is running somewhere between 1,000 and 5,000 90nm wafers a month.
		Xilinx is also on the 1,000 to 5,000 wafers level, having started running 90nm wafers at UMC in January 2003 and achieved its first 90nm production qualified parts in January 2004.
		Electronics Weekly is the London-based sister publication of Electronic News.
	www.edn.com /article/CA380964.html?partner=eb&spacedesc=news&rid=0&rme=0&cfd=1 (406 words)

	Dongbu Electronics \| leading-edge mainstream & CMOS process Technology (Site not responding. Last check: 2007-10-25)
		Offering leading-edge mainstream and specialized CMOS process technologies, Dongbu Electronics is a pure-play semiconductor foundry dedicated to serving fabless companies, integrated device manufacturers (IDMs) and systems companies worldwide.
		Among the industry leaders that have placed their trust in Dongbu Electronics's dedicated wafer foundry services are Philips Semiconductors, Samsung Electronics, Texas Instruments and Toshiba Semiconductor.
		Committed to growth and customer satisfaction, Dongbu Electronics has the flexibility to respond to different wafer processing requirements within its first-rate quality management system.
	www.dongbuelec.com /eng/about/index.html (158 words)

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