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	Wire bonding - Wikipedia, the free encyclopedia
		Wire bonding is a method of making interconnections between a microchip and the outside world as part of semiconductor device fabrication.
		In either type of wire bonding, the wire is attached at both ends using some combination of heat, pressure, and ultrasonic energy to make a weld.
		Wire bonding is generally considered the most cost-effective and flexible interconnect technology, and is used to assemble the vast majority of semiconductor packages.
	en.wikipedia.org /wiki/Wire_bonding (161 words)

	Wire Bonding (Site not responding. Last check: 2007-10-24)
		Contamination may be in the form of oxides on the bonding interfaces or foreign chemical substances attached either on the metal surfaces or on the oxides already present on the metal surfaces.
		However, the interface temperature between the bonding surfaces will be critical to a good bond unless ultrasonic energy is used; therefore, if many wire bonds are to be made, 320 degrees C temperature for a long bonding period will degrade the semiconductors.
		The gold wire is fed through a capillary, usually made of tungsten carbide, and a small hydrogen flame or electric discharge is used to cut the wire and form a ball on the end of that wire.
	www.techiedo.com /wire_bonding.htm (2788 words)

	Stacked multi-chip package, process for fabrication of chip structuring package, and process for wire-bonding - US ... (Site not responding. Last check: 2007-10-24)
		Bonding posts 30 are arranged on the glass epoxy substrate 10 in lines (which may be staggered) running along end faces of the lower chip 12, at predetermined distances from the end faces of the lower chip 12.
		Next, a bonding apparatus (not shown) is moved from the Al pads 28 of the lower chip 12 to the bonding posts 30, the bonding is performed resulting in the interconnection of the Au wires 20.
		In the same way, the bonding apparatus is moved from the Al pads 36 of the intermediate chip 24 to the bonding posts 30, performs bonding, and thus interconnects the Au wires 42 (this wiring sequence of the intermediate chip 22 and the intermediate chip 24 may be reversed).
	www.patentstorm.us /patents/6777797.html (6175 words)

	Empfasis - Wire Bonding Techniques
		A wire bond is the welded electrical interconnection on a PCB, usually from the semiconductor die to the non-common lead frame or substrate pad.
		After bonding, the wire bond may be evaluated using visual methods and mechanical testing, depending on the requirements and situation.
		Wire bonding techniques may pose a new challenge to your manufacturing assembly.
	www.empf.org /empfasis/july04/wire.htm (718 words)

	A quick primer on bonding wire parameters
		As a result, lead wire bonding, used for the formation of interconnects in ICs, has become perhaps the most sophisticated process of all the IC assembly operations.
		Bonding wire is usually specified because of its strength, based on the metallurgical characteristics of "elongation" and "breaking load." Both gold and aluminum are strong.
		Gold wires for ball bonding are normally supplied in the annealed condition to prevent unwanted "breakoff' partial annealing during ball formation.
	www.calfinewire.com /articles/bonding.htm (1813 words)

	Journal of Electronic Materials: Process Windows for Low-Temperature Au Wire Bonding
		Wide ranges of wire bond force, bond power, and bond-pad temperature were used to identify the combination of these processing parameters that can produce good wire bonds, allowing the construction of process windows.
		Wire bonding is the most common first-level interconnection technology used between die and package terminals.
		Thermosonic gold-wire wedge bonding was preformed on a wedge bonder equipped with a 61.2 kHz transducer.
	www.findarticles.com /p/articles/mi_qa3776/is_200402/ai_n9393149 (1255 words)

	Open-center flexural pivot wire bonding head - Patent 4598853
		The bonding head of claim 1 wherein each said first and second resilient means comprise a leaf spring assembly having leaf spring arms and a center portion between said leaf spring arms, said leaf spring arms and center portion forming a truncated vee.
		The bonding head of claim 1 further including means for applying a pre-load force to said first and second resilient means such that said pre-load force is transferred to the bonding tool upon its contact with a workpiece.
		The wire clamp assembly 75 includes an aperture 81 which functions as a wire guide, and also includes a clamping arm 83 which is selectively actuated to press against the bonding tool so that the bonding wire can be clamped.
	www.freepatentsonline.com /4598853.html (2758 words)

	"Closed Loop" Study for Wire Bonding Process
		The intent of this paper is to establish the feasibility of using a "closed loop" wire bonding study mainly for fine pitch and UFP bonding application.
		In wire bonding, the bonding tool vibration amplitude is the most important parameter which influences the energy delivered to the bond zone.
		To simulate the effect of bond surface variation due to contamination or other causes, bonding was carried out on different bond surface conditions (good and defective) and the impedance in time domain was recorded at 0.6, 2.4, 4.8, 7.2, and 9.6msec as shown in Figure 13.
	www.sptusa.com /closed_loop.html (1924 words)

	[No title] (Site not responding. Last check: 2007-10-24)
		The tail bond is the weld between the short piece of wire, which subsequently will be used to form the next ball, and the substrate.
		Capillaries must be dimensioned to avoid interference between the capillary and adjacent wires and bonds, in addition to being optimized for bond quality.
		Figure 8 is a close-up of wires bonded to the pads, with the distribution ring shown.
	www.reed-electronics.com /SEMICONDUCTOR/index.asp?layout=articlePrint&articleID=CA164007 (2494 words)

	dbanks - Wire Bonding - Microengineering Intro (Site not responding. Last check: 2007-10-24)
		In thermocompression bonding, the die and the wire are heated to a high temperature (around 250 Celsius).
		The tip of the wire is heated to form a ball, the tool holding it then forces it into contact with the bonding pad on the chip.
		In this case, the wire and bonding surface (pad or frame) are forced together the tool, and ultrasonic vibration is used to compress the surfaces together to achieve the desired bond.
	www.dbanks.demon.co.uk /ueng/wbonding.html (246 words)

	Advantages of Using Bondable Wire
		With the use of resistance bonding, manufacturers are able to accomplish the testing and bonding processes anywhere from 5 and 30 seconds.
		The testing and the bonding applications are combined, which increases the overall workflow, reduces the in-process inventory and significantly increases output.
		When you initially look at the cost of the bondable wire compared to the same class of non-bondable wire the cost is greater.
	www.eswtesters.com /advantages.htm (411 words)

	Wire-bonding method and apparatus - Patent 4864514 (Site not responding. Last check: 2007-10-24)
		The bonding data having been transformed by the minicomputer 40 is delivered to the bonding unit 50 by using a floppy or flexible disk 41 as a medium.
		However, since the bonding apparatus is ordinarily constructed in an independent manner without consideration of the coordinate system of the CAD system, positional discrepancy or shift of the origin and rotational discrepancy or shift of the coordinate axis occur between both the coordinate systems.
		Further, since the object of bonding ordinarily is heated to conduct bonding in the bonding unit, there is the possibility that variable magnification discrepancy or shift occurs with respect to the CAD data which is a value designed at normal temperature due to the thermal expansion at the time of bonding.
	www.freepatentsonline.com /4864514.html (4351 words)

	Electrical Manufacturing: Self-Bonding Magnet Wire (Site not responding. Last check: 2007-10-24)
		Bonding occurs only in the areas where the wires are touching with adequate pressure to allow thermoplastic flow of the bondcoat polymer.
		Heat-oven bonding: After the coils are formed, the unit is heated in an oven, causing the bondcoat to flow, bonding the adjacent turns of wire together.
		The basecoat insulation, combined with the thermoplastic flow of the bondcoat polymer between adjacent wires during the bonding process, increases the CIV of the bondable wire and therefore increases the life of the total bondable wire construction.
	www.ammagazine.com /CDA/ArticleInformation/Electrical_Mfg_Item/0,4158,17486,00.html (1462 words)

	Journal of Electronic Materials: Development of a Thermosonic Wire-Bonding Process for Gold Wire Bonding to Copper Pads ... (Site not responding. Last check: 2007-10-24)
		The bonding strength of Au/Cu ball bonds increases slightly with prolonged storage duration because of diffusion between the gold ball and copper pad during the HTS test.
		The typical stage-temperature range for TS wire bonding is between 125°C and 220°C.5 However, copper oxidizes easily in the air environment, and unlike aluminum, no stable self-passivation layer is formed during oxidation.
		Improvement on bondability of gold wire bonding to the copper pad under argon shielding was illustrated, and the bonding mechanism was interpreted.
	www.findarticles.com /p/articles/mi_qa3776/is_200404/ai_n9366744 (1385 words)

	A Probabilistic Approach for Predicting Thermal Fatigue Life of Wire Bonding in Microelectronics (Site not responding. Last check: 2007-10-24)
		Wire bond connections are susceptible to fatigue failure as a result of various thermo-mechanical damage mechanisms during the component operation life.
		Because of uncertainties arising from the random nature of temperature fluctuations, the assembly of wire bonds, and fatigue properties of bonding materials, probabilistic analysis and reliability estimations are appropriate.
		To determine the behavior of wire bonds under thermal cycles, the stress amplitude due to the temperature fluctuation in each fatigue failure mechanism is derived based on stress analysis models, the uncertainties involved in stress determination and life prediction are analyzed, and a life prediction equation is proposed.
	www.calce.umd.edu /articles/abstracts/1991/probapp.htm (160 words)

	Advanced Packaging - 10<sup>th</sup> Anniversary Insights<br>The wire-bonding tyranny of ...
		Those in packaging know from early in their careers that given a "choice" between interconnects, wire bonding would be the winner most often, for the overriding rea-son that it is ultimately a lower cost tech- nology.
		By some estimates, of the total wire bond interconnects in the years 2005 to 2006, about a third will be at pad pitches of less than 60 µm.
		New bonding wire alloys are being developed to improve performance (such as lower loops for BGAs and less sweep during molding for fine-pitch packages).
	ap.pennnet.com /Articles/Article_Display.cfm?Article_ID=135528&CFID=19759&CFTOKEN=10138534 (1360 words)

	Fine Pitch Copper Wire Bonding Process and Materials Study (Site not responding. Last check: 2007-10-24)
		Consequently, the capillary geometrical considerations for the copper wire bonding affecting the bonded ball diameter, and stitch are also similar to that of the gold wire- except that proper face angle and outer radius design combination are essential to provide optimum stitch formation and reliability.
		The stitch bond on the BGA substrate has to overcome a layer of copper oxide on the copper wire surface prior to bonding.
		With the continuous development of the wire bonder together with the right capillary design and wire type, similar ultra fine pitch capability with copper wire would be achievable in the near future.
	www.smallprecisiontools.com /Cu_wb.html (1646 words)

	NASA Goddard Space Flight Center (Site not responding. Last check: 2007-10-24)
		General information about wire bonding technology is provided to give background information to those readers who are not familiar with it or with the vast amount of literature available on this topic.
		Bond pad features were found to harbor contamination causing "poor" bonds.
		Very "flat" bond wires use a different bond pull test criteria than is used with wires with typical stress reliving loops.
	nepp.nasa.gov /wirebond (396 words)

	Chip Scale Package (CSP) Wire Bonding Capability Study
		In this study, the focus will be made on the CSP package types using wire bonding interconnect technology, which was performed to determine the degree of limitation and challenges of having a short and low looping profile as dictated by the allowable CSP package thickness.
		For the CSP wire bonding, since the major consideration is the die edge wedge distance (DEWD), which is at 200µm to 300µm range, the wire bonder looping software algorithm is able to handle such a kind of short and sharp looping trajectory motion.
		The special bottlenecked typed capillary design for 60µm BPP using a 25µm wire diameter (WD) having a modified bottleneck height (BNH) of 500µm deep access capability is essential to clear the adjacent loop (without causing interference) as it vertically travels to form the stitch bond without shorting the edge of the die.
	www.sptca.com /csp_wbs.html (1430 words)

	Advanced Packaging - The back-end process: Step 4 - Wire bonding step by step
		The wire bonder is now ready to start the bond process, connecting the bondpad on the chip with the leadfinger on the substrate.
		During the bond process, the bondforce, as well as the ultrasonic power, is closed-loop controlled (i.e., the applied bondforce is checked and controlled according to its predefined values).
		As wire bonding pushes its physical limits, the challenge is to maintain process reliability and process control at a standard while increasing equipment productivity.
	ap.pennnet.com /Articles/Article_Display.cfm?Article_ID=96512&CFID=1615&CFTOKEN=76014118 (1949 words)

	WAM - Bonding Wire and Ribbon
		Bonding wire is manufactured using our proprietary hydrostatic extrusion process, providing a cleaner and more uniform wire.
		Gold wire is produced to meet the specifications of virtually all industry bonders and applications.
		Williams' extrusion process is well suited to achieve the metallurgical consistency and winding requirements of all bonding ribbon applications.
	www.bita.se /bitase1/wam-wire.htm (109 words)

	Wire Bonding, Die Bonding, Chip on Board, Wire Bonding at CIL
		Using its automatic die / wire bonders it is able to wire bond all commercially available semiconductor die.
		This is backed up with wirebond and die bond pull test and shear results using the latest SPC techniques.
		Using a combination of CAD design coupled with its highly automated SMT equipment and "state of the art "chip and wire bonding facility CIL is able to offer advanced solutions to customers packaging problems.
	www.cil-uk.co.uk /amt/amt.htm (730 words)

	IMAPS - International Microelectronics And Packaging Society
		Wire bond manufacturing defects range typically from about 1000 to 100 ppm, with exceptions to >10,000 and <50 ppm.
		New developments (e.g., high frequency ultrasonic bonding), are included along with a major discussion of wire bonding to multichip modules and other soft substrates.
		Wire bond testing and metallurgy (covering both aluminum and gold bonds); intermetallic compounds; cleaning for yield and reliability; failures resulting from electroplating; mechanical problems in wire bonding; new bond technologies and developments; how ultrasonic bonds are formed, and the metallurgy of gold and aluminum wire.
	www.imaps.org /adv_micro/2002jul_aug/12.html (6585 words)

	Machine vision aids IC wire bonding: News from Cognex UK
		Machine vision systems, which play an important role in enabling precise wire bonding by automatically locating proper bond points and the position of lead tips, face some extraordinary challenges with respect to today's fine pitch devices.
		For example, a vision system must be able to locate bond pads on a die with extremely high accuracy even though there is often less visual information to work with.
		Having successfully used in-house vision system in previous wire bonding equipment, ESEC chose to equip the 3088iP with a Cognex MVS-82400/VME embedded vision system, which features an on-board MMX processor and a suite of specialised vision software tools.
	www.engineeringtalk.com /news/cog/cog143.html (1212 words)

	Amazon.com: Wire Bonding in Microelectronics: Materials, Processes, Reliability, and Yield: Books: George Harman (Site not responding. Last check: 2007-10-24)
		Wire Bonding in Microelectronics Second Edition the definitive single-volume reference on wire bonding just got better--in an extensively updated edition with over 100 new pages on new materials, new interconnect techniques such as fine pitch wire bonding, and evaluating the pros and cons of alternative bonding technologies.
		Wire bonds are used to interconnect integrated circuits, multichip modules and hybrids, and microwave as well as power devices to their packages.
		The book explains it all, with special emphasis on fine pitch bonding, bonding to MCMs, and additional areas that have been developed since the first edition was published.
	www.amazon.com /exec/obidos/tg/detail/-/0070326193?v=glance (850 words)

	[mems-talk] Wire bonding to Pt and Cu pads (Site not responding. Last check: 2007-10-24)
		Hello, I am considering using ultrasonic bonding of Al/gold wire to platinum and copper pads on a device and would appreciate any comments on the following points: 1> The platinum pad (400 nm) is deposited by evaporation on Si.
		Since it is a part of an RTD sensor, using a conducting adhesion layer is not advisable.
		The pad does not have to be copper if there are other metals which are easier/preferable for wire bonding.
	mail.mems-exchange.org /pipermail/mems-talk/2001-December/005843.html (210 words)

	Techstar Upgrading kit - to enhance normal pitch wire bonder to perform fine pitch wire bonding.
		There are a few new Fine Pitch Gold Wire Bonding machines in the market costing between the range of US$90K to US$130K, eg.
		For gold wire of diameter 20um to 50um, Free-Air Ball consistency of 35um to 80um can be composed.
		For other wire bonding machines, please contact our sales team for special customisation.
	www.techstar-i.com /vesta-s.htm (521 words)

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